Patents by Inventor Stephan Stoecki

Stephan Stoecki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEMBLING SAME
    Publication number: 20220294115
    Abstract: A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.
    Type: Application
    Filed: June 2, 2022
    Publication date: September 15, 2022
    Inventors: Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoecki, Thomas Wagner, Josef Hagn
  • CTE ADAPTION IN A SEMICONDUCTOR PACKAGE
    Publication number: 20130328191
    Abstract: A device such as a wafer-level package (WLP) device is proposed in which a dielectric layer is disposed between a surface of a semiconductor device and a surface of a redistribution layer (RDL). The dielectric layer may have at least one interconnect extending through the dielectric layer. The dielectric layer may have a coefficient of thermal expansion (CTE) value in a direction perpendicular to the surface of the semiconductor device that is less than a threshold value, and a Young's modulus that is greater than another threshold value.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 12, 2013
    Applicant: Intel Mobile Communications GmbH
    Inventors: Thorsten Meyer, Gerald Ofner, Stephan Stoecki