Abstract: Metal substrates comprising a colored coating and/or a protective coating disposed on at least a surface of the substrate. The colored coating can include a metal oxide coating integrally bonded to the terminal and produced by heat tinting or a titanium nitride containing material. The protective coating is derived from a material comprising one or more of aluminum oxide, silicon oxide, a superhydrophobic material, wherein the protective coating has a Scratch Resistance of at least about F, as determined by ASTM D336. Methods of making and using the coated metal substrates are also disclosed.

Abstract: The various embodiments of the present invention provide carbon nanotube (CNT)-based TSVs and methods of making the same. The CNT-based TSVs embodiments comprise a silicon wafer having a plurality of through-vias defined therein, and a support layer comprising a CNT catalyst layer disposed beneath the silicon wafer to facilitate CNT growth through the plurality of through-vias. Once CNT arrays have grown inside and through the through-vias, the support layer and accompanying CNT catalyst layer can be removed from the silicon wafer, which will result in the CNTs remaining in the TSVs.