Abstract: A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.

Abstract: A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.

Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.

Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.

Abstract: A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is injected by a dispensing apparatus (8, 9) into the holes (5) in the circuit board (2) with the formation of marginal overlaps (12), such that a protruding, outwardly spreading plug (11) of conductive paste is formed. In accordance with the method, a cartridge needle (8) of the dispensing apparatus (8, 9) is placed against the circuit board (2) at the location of each hole (5) that is to be provided with a through-connection, and solderable conductive paste (10) is dispensed into the hole (5), after which the cartridge needle (8) is removed.