Patents by Inventor Stephane Bellenger

Stephane Bellenger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged semiconductor product and method for manufacture thereof
    Patent number: 8963314
    Abstract: Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first semiconductor device (4A) has a first substrate (11A) and is provided with a first passivation layer (12A) and a first electronic structure. The first substrate has a first main surface (14). The first substrate (11A) is embedded in the protective envelope (6) and the first main surface (14) faces a first opening (23) of the protective envelope (6). The first electronic structure has a first and a second contact region (20, 22) for electrically contacting the first electronic structure. The first passivation layer (12A) substantially covers the first main surface (14) and the first electronic structure. The protective envelope (6) extends between the first passivation layer (12A) and the first external electrode (8) towards the first contact region (20).
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: February 24, 2015
    Assignee: NXP B.V.
    Inventors: Eric Pieraerts, Jean-Marc Yannou, Stephane Bellenger, Mickael Pommier
  • PACKAGED SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURE THEREOF
    Publication number: 20110180897
    Abstract: Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first semiconductor device (4A) has a first substrate (11A) and is provided with a first passivation layer (12A) and a first electronic structure. The first substrate has a first main surface (14). The first substrate (11A) is embedded in the protective envelope (6) and the first main surface (14) faces a first opening (23) of the protective envelope (6). The first electronic structure has a first and a second contact region (20, 22) for electrically contacting the first electronic structure. The first passivation layer (12A) substantially covers the first main surface (14) and the first electronic structure. The protective envelope (6) extends between the first passivation layer (12A) and the first external electrode (8) towards the first contact region (20).
    Type: Application
    Filed: June 26, 2009
    Publication date: July 28, 2011
    Applicant: NXP B.V.
    Inventors: Eric Pieraerts, Jean-Marc Yannou, Stephane Bellenger, Mickael Pommier