Patents by Inventor Stephane Caplet
Stephane Caplet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11430373Abstract: A display device includes a support and first and second conductive electrical power supply elements, the first conductive element being arranged on the support. The display device also includes LED modules, each including at least one LED and two electrical power supply pads that are arranged on two opposite faces, respectively, of the LED module, one of which corresponds to an emissive face of the LED. The electrical power supply pads of each LED module are connected to the first and second conductive electrical power supply elements, respectively, and the connection area of an electrical power supply pad of an LED module for connection with the first conductive electrical power supply element is smaller than a receiving area of the first conductive element corresponding to the area of the first conductive element in a parallel plane to the connection areas of the power supply pads of the LED modules.Type: GrantFiled: July 3, 2018Date of Patent: August 30, 2022Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Ivan-Christophe Robin, Bertrand Dupont, Stephane Caplet, Emeric De Foucauld, Umberto Rossini, Alexei Tchelnokov, Francois Templier
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Publication number: 20210142716Abstract: A display device includes a support and first and second conductive electrical power supply elements, the first conductive element being arranged on the support. The display device also includes LED modules, each including at least one LED and two electrical power supply pads that are arranged on two opposite faces, respectively, of the LED module, one of which corresponds to an emissive face of the LED. The electrical power supply pads of each LED module are connected to the first and second conductive electrical power supply elements, respectively, and the connection area of an electrical power supply pad of an LED module for connection with the first conductive electrical power supply element is smaller than a receiving area of the first conductive element corresponding to the area of the first conductive element in a parallel plane to the connection areas of the power supply pads of the LED modules.Type: ApplicationFiled: July 3, 2018Publication date: May 13, 2021Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Ivan-Christophe ROBIN, Bertrand DUPONT, Stephane CAPLET, Emeric DE FOUCAULD, Umberto ROSSINI, Alexei TCHELNOKOV, Francois TEMPLIER
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Patent number: 10991738Abstract: A method for producing curved electronic circuits is provided, including placing adhesive elements between electronic chips and curved bearing surfaces, with the chips disposed between the surfaces and a flexible film, and such that the chips, the elements, and the surfaces are arranged in a single volume to be depressurised towards an environment outside the volume, the volume including empty spaces between the chips and the surfaces, the spaces being in fluid communication with each other within the volume; establishing a pressure difference between an inside and an outside of the volume such that the film applies a pressure on and collectively deforms the chips in accordance with the surfaces; and stopping the establishing of the pressure difference, the chips being collectively maintained against the surfaces by the elements such that a shape of each of the chips conforms to a corresponding shape of each of the surfaces.Type: GrantFiled: November 2, 2018Date of Patent: April 27, 2021Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand Chambion, Stephane Caplet
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Publication number: 20190140008Abstract: Method for collectively producing several curved electronic circuits, including: putting in place several adhesive elements between several electronic chips and several curved bearing surfaces, and with the chips arranged between the curved bearing surfaces and a flexible film, and such that the chips, the adhesive elements and the curved bearing surfaces are arranged in a single volume able to be depressurised towards the environment outside the volume and including empty spaces present between the electronic chips and the curved bearing surfaces; establishing a pressure difference between the inside and the outside of the volume such that the flexible film applies a pressure on the chips deforming them in accordance with the curved bearing surfaces; stopping the application of the pressure difference, the curved chips being maintained against the curved bearing surfaces by the adhesive elements.Type: ApplicationFiled: November 2, 2018Publication date: May 9, 2019Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand CHAMBION, Stephane CAPLET
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Patent number: 9309110Abstract: A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.Type: GrantFiled: June 29, 2009Date of Patent: April 12, 2016Assignee: Commissariat A L'Energie AtomiqueInventors: Stephane Caplet, Xavier Baillin, Jean-Louis Pornin
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Patent number: 9260291Abstract: Getter structure comprising a substrate and at least one getter material-based layer mechanically connected to the substrate by means of at least one support, in which the surface of the support in contact with the substrate is smaller than the surface of a first face of the getter material layer, in which said first face is in contact with the support, and a second face of the getter material layer, opposite said first face is at least partially exposed.Type: GrantFiled: June 29, 2009Date of Patent: February 16, 2016Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane Caplet, Xavier Baillin
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Patent number: 8324695Abstract: An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.Type: GrantFiled: November 6, 2008Date of Patent: December 4, 2012Assignee: Commissariat a l'energie atomique et aux energies alternativesInventor: Stephane Caplet
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Publication number: 20100244246Abstract: An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.Type: ApplicationFiled: November 6, 2008Publication date: September 30, 2010Applicant: COMMISS. A L'ENERGIE ATOM. ET AUX ENER. ALTERN.Inventor: Stephane Caplet
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Patent number: 7700457Abstract: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.Type: GrantFiled: December 17, 2002Date of Patent: April 20, 2010Assignee: Commissariat a L'Energie AtomiqueInventors: Bernard Diem, Stephane Caplet, Marie-Thérèse Delaye
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Publication number: 20100014036Abstract: A process for formation of cavities of a micro-optic device, comprising: a) formation, on the surface plane of a support, of an alignment layer of liquid crystals; and b) formation of walls of said cavities, the base of said cavities being formed by said alignment layer.Type: ApplicationFiled: July 13, 2009Publication date: January 21, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane CAPLET
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Publication number: 20100001361Abstract: Getter structure comprising a substrate and at least one getter material-based layer mechanically connected to the substrate by means of at least one support, in which the surface of the support in contact with the substrate is smaller than the surface of a first face of the getter material layer, in which said first face is in contact with the support, and a second face of the getter material layer, opposite said first face is at least partially exposed.Type: ApplicationFiled: June 29, 2009Publication date: January 7, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane CAPLET, Xavier BAILLIN
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Publication number: 20100003789Abstract: A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.Type: ApplicationFiled: June 29, 2009Publication date: January 7, 2010Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane CAPLET, Xavier Baillin, Jean-Louis Pornin
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Publication number: 20090261431Abstract: A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.Type: ApplicationFiled: December 18, 2008Publication date: October 22, 2009Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane Caplet
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Publication number: 20090170312Abstract: A method for producing a micromechanical and/or nanomechanical device comprising the steps of: partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate, chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer, elimination of said portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate.Type: ApplicationFiled: December 16, 2008Publication date: July 2, 2009Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventor: Stephane Caplet
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Publication number: 20080000948Abstract: The inventive method for closing a vent (9) formed in a microstructure (3) wall (10) under a controlled atmosphere is carried out by an ultrasonic bonding machine comprising a welding electrode (14), a metal wire (13) crossing the electrode (14) and a working table (15). A ball (12) is formed by melting on the end part of the metal wire (13) and is deposited on the end of the vent (9) and a holding plug (11) and is subsequently exposed to compression forces (F) and ultrasonic vibration (Fus) by the electrode (14) in a controlled atmosphere chamber (17).Type: ApplicationFiled: May 3, 2005Publication date: January 3, 2008Inventors: Henri Blanc, Stephane Caplet
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Publication number: 20070122929Abstract: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.Type: ApplicationFiled: December 17, 2002Publication date: May 31, 2007Inventors: Bernard Diem, Stephane Caplet, Marie-Therese Delaye
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Publication number: 20040092041Abstract: A device for detecting electromagnetic radiation including at least one detection circuit including a non-cooled thermal detector and an associated reading circuit, and a method for producing the device. The device includes a substrate forming a cavity under vacuum, in which are placed the thermal detector and the reading circuit. A window transparent to radiation is placed above the cavity and ensures the sealing of the cavity. A sealing mechanism hermetically attaches the window on the substrate, and an electrical connection is inserted in the window ensuring a leaktight connection between the detection circuit and processing elements outside the cavity.Type: ApplicationFiled: April 29, 2003Publication date: May 13, 2004Inventors: Jean-Louis Ouvrier-Buffet, Sylvette Bisotto, Stephane Caplet
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Publication number: 20030166310Abstract: A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.Type: ApplicationFiled: December 27, 2002Publication date: September 4, 2003Inventor: Stephane Caplet
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Publication number: 20020088646Abstract: Structure equipped with electrical contacts formed through the substrate of this structure and the process for obtaining such a structure.Type: ApplicationFiled: March 13, 2002Publication date: July 11, 2002Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Stephane Caplet, Marie-Therese Delaye
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Patent number: 6029517Abstract: The invention relates to a miniaturized accelerometer of the type with spring compensation of the gravity effect. The accelerometer seismic mass (1), its support and the compensating spring (2) are produced in the same substrate (10), regulating means being provided for placing the spring under mechanical tension.Type: GrantFiled: June 2, 1998Date of Patent: February 29, 2000Assignee: Commissariat a l'Energie AtomiqueInventors: Jean Brun, Stephane Caplet