Patents by Inventor Stephane Coletti

Stephane Coletti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TREATMENT OF SEMICONDUCTOR WAFERS
    Publication number: 20080063872
    Abstract: A semiconductor wafer having a surface layer of semiconductor material that exhibits a reduced number of defects. This feature is achieved by a treatment method wherein the surface layer undergoes a chemical-mechanical polishing step, an intermediate step of cleaning the surface of the surface layer of semiconductor material using an SC1 solution, and then an RCA cleaning step.
    Type: Application
    Filed: November 13, 2007
    Publication date: March 13, 2008
    Applicant: S.O.I. Tec Silicon on Insulator Technologies
    Inventors: Stephane Coletti, Veronique Duquennoy-Pont
  • Treatment of semiconductor wafers
    Patent number: 7312153
    Abstract: A method is described for treating a wafer having at least a surface layer of semiconductor material, with the surface of this surface layer having undergone a chemical-mechanical polishing step followed by an RCA cleaning step. After the polishing step and prior to the RCA cleaning step, the method includes an intermediate step of cleaning the surface of the surface layer of semiconductor material using an SC1 solution under concentration and temperature conditions that allow the emergence of defects in the surface layer (curve B) to be reduced compared with a similar surface layer which has not undergone such an intermediate cleaning step (curve A).
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: December 25, 2007
    Assignee: S.O.I.Tec Silicon on Insulator Technologies
    Inventors: Stéphane Coletti, Véronique Duquennoy-Pont
  • Treatment of semiconductor wafers
    Publication number: 20060234507
    Abstract: A method is described for treating a wafer having at least a surface layer of semiconductor material, with the surface of this surface layer having undergone a chemical-mechanical polishing step followed by an RCA cleaning step. After the polishing step and prior to the RCA cleaning step, the method includes an intermediate step of cleaning the surface of the surface layer of semiconductor material using an SC1 solution under concentration and temperature conditions that allow the emergence of defects in the surface layer (curve B) to be reduced compared with a similar surface layer which has not undergone such an intermediate cleaning step (curve A).
    Type: Application
    Filed: October 20, 2005
    Publication date: October 19, 2006
    Inventors: Stephane Coletti, Veronique Duquennoy-Pont