Patents by Inventor Stephane G. Harel

Stephane G. Harel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor photonic package
    Patent number: 9243784
    Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: January 26, 2016
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov
  • Semiconductor photonic package
    Patent number: 9206965
    Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: December 8, 2015
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov
  • SEMICONDUCTOR PHOTONIC PACKAGE
    Publication number: 20140177222
    Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov
  • SEMICONDUCTOR PHOTONIC PACKAGE
    Publication number: 20140179034
    Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
    Type: Application
    Filed: August 19, 2013
    Publication date: June 26, 2014
    Applicant: International Business Machines Corporation
    Inventors: Tymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov