Abstract: An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.

Abstract: An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.

Abstract: An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.

Abstract: An integrated circuit chip and a method for protecting the integrated circuit chip against physical and/or electrical alterations are disclosed. The chip comprises at least one semiconductor layer including semiconductor components and conductive tracks, at least one layer formed by a first type of conductive tracks extending over all or part of a surface of the chip and at least one second type of conductive track connected to at least one detection circuit configured to detect an alteration of the at least one second type of conductive track. The chip is characterized in that the at least one first type of conductive track is mixed within the at least one second type of conductive track, the material and the layout of at least one second type of conductive track being indiscernible, by an observation device, from the material and the layout of the at least one first type of conductive track.

Abstract: An integrated circuit chip and a method for protecting the integrated circuit chip against physical and/or electrical alterations are disclosed. The chip comprises at least one semiconductor layer including semiconductor components and conductive tracks, at least one layer formed by a first type of conductive tracks extending over all or part of a surface of the chip and at least one second type of conductive track connected to at least one detection circuit configured to detect an alteration of the at least one second type of conductive track. The chip is characterized in that the at least one first type of conductive track is mixed within the at least one second type of conductive track, the material and the layout of at least one second type of conductive track being indiscernible, by an observation device, from the material and the layout of the at least one first type of conductive track.