Abstract: A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Abstract: A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Abstract: An optical modulation apparatus comprises first, second, and third optical modulators arranged so as to collectively modulate light coupled into a first optical input in all three dimensions of the three-dimensional Stokes vector space, to produce an optical output signal. The optical modulation apparatus further comprises a modulating circuit having a digital input configured to N generate first, second, and third modulating signals for driving the first, second, and third optical modulators so as to map digital data to an M-point optical constellation in the optical output signal. The points in the M-point optical constellation are distributed in the three-dimensional Stokes vector space such that the constellation figure of merit for the M-point optical constellation equals at least half of the maximum achievable constellation figure of merit for M points in the three-dimensional Stokes vector space.

Abstract: According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

Abstract: The disclosure relates to a transceiver operative to transmit and receive optical signals. The transceiver comprises a laser, a power splitter, a dual-polarization in-phase and quadrature modulator, DP-IQM, a first circulator (C1, C3), a second circulator (C2, C4), a first optical polarization controller, PC, a second optical polarization controller and a dual-polarization coherent receiver, DP-CRx. There is provided a system comprising a first transceiver and a second transceiver as described previously. The transceiver requires neither high speed DSP nor high resolution data converters to achieve 50 Gbaud DP-16 QAM, DP standing for dual polarization and QAM standing for quadrature amplitude modulation, yielding 400 Gb/s over 10 km below the 2.2×10?4 KP4 forward error correction (FEC) threshold.

Abstract: An electronic-photonic integrated-circuit assembly comprises a carrier substrate (310) and one or more integrated-circuit dies (330, 340) bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages (320) are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate (310) is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (320), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.

Abstract: According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

Abstract: An optical modulation apparatus comprises first, second, and third optical modulators arranged so as to collectively modulate light coupled into a first optical input in all three dimensions of the three-dimensional Stokes vector space, to produce an optical output signal. The optical modulation apparatus further comprises a modulating circuit having a digital input configured to N generate first, second, and third modulating signals for driving the first, second, and third optical modulators so as to map digital data to an M-point optical constellation in the optical output signal. The points in the M-point optical constellation are distributed in the three-dimensional Stokes vector space such that the constellation figure of merit for the M-point optical constellation equals at least half of the maximum achievable constellation figure of merit for M points in the three-dimensional Stokes vector space.

Abstract: A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Abstract: The disclosure relates to a transceiver operative to transmit and receive optical signals. The transceiver comprises a laser, a power splitter, a dual-polarization in-phase and quadrature modulator, DP-IQM, a first circulator (C1, C3), a second circulator (C2, C4), a first optical polarization controller, PC, a second optical polarization controller and a dual-polarization coherent receiver, DP-CRx. There is provided a system comprising a first transceiver and a second transceiver as described previously. The transceiver requires neither high speed DSP nor high resolution data converters to achieve 50 Gbaud DP-16 QAM, DP standing for dual polarization and QAM standing for quadrature amplitude modulation, yielding 400 Gb/s over 10 km below the 2.2×10?4 KP4 forward error correction (FEC) threshold.

Abstract: A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Abstract: There is provided a reconfigurable optical modulator comprising a light source and a splitter operative to receive an input signal from the light source and to split the input signal into a plurality of split signals. The optical modulator comprises a plurality of optical amplifiers, each being operative to receive one of the plurality of split signals as an input and to act as a switch having a first state where the split signal is blocked and a second state where the split signal is amplified. The optical modulator comprises a plurality of modulators, each being operative to receive an amplified split signal from one of the plurality of optical amplifiers and to modulate the amplified split signal into a modulated signal. The optical modulator comprises an optical combiner operative to combine a plurality of modulated signals produced by the plurality of modulators to thereby produce a modulated output signal.

Abstract: There is provided a reconfigurable optical modulator comprising a light source and a splitter operative to receive an input signal from the light source and to split the input signal into a plurality of split signals. The optical modulator comprises a plurality of optical amplifiers, each being operative to receive one of the plurality of split signals as an input and to act as a switch having a first state where the split signal is blocked and a second state where the split signal is amplified. The optical modulator comprises a plurality of modulators, each being operative to receive an amplified split signal from one of the plurality of optical amplifiers and to modulate the amplified split signal into a modulated signal. The optical modulator comprises an optical combiner operative to combine a plurality of modulated signals produced by the plurality of modulators to thereby produce a modulated output signal.

Abstract: An electronic-photonic integrated-circuit assembly comprises a carrier substrate (310) and one or more integrated-circuit dies (330, 340) bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages (320) are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate (310) is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (320), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.

Abstract: A small form-factor pluggable (SFP) module and related method are provided to perform additional packet processing in a communication network. The SFP module is generally configured to at least partially process data packets as they transit from a first networking equipment toward a second networking equipment in order to modify or otherwise update header information of the packets as a function of the content of their data payload. Modifying header information of data packets as they transit between interconnected networking equipments allows interconnected networking equipments to perform packet processing on the modified header information.

Abstract: The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Abstract: The teachings herein disclose a laser assembly (20) that implements a “composite cavity” formed in part in a III/V die (22), in part in a silicon die (26), and in part in a glass member (24) having a waveguide (44) coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

Abstract: The teachings herein disclose a laser assembly (20) that implements a “composite cavity” formed in part in a III/V die (22), in part in a silicon die (26), and in part in a glass member (24) having a waveguide (44) coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

Abstract: The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Abstract: A silicon photonic device comprises a silicon core having a core refractive index and a structure formed in the silicon core. The structure comprises a first refractive index variation pattern across the core in a first direction (x) and having a first modulation depth (H1), and a second refractive index variation pattern across the core in a second, orthogonal, direction (y) and having a second modulation depth (H2), less than the first modulation depth. The first refractive index variation pattern overlays the second refractive index variation pattern, forming a three-dimensional structure. The first refractive index variation pattern only supports propagation of light having a TM mode between the first direction and a third direction (z) and the second refractive index variation pattern only supports propagation of light having a TE mode between the second direction and the third direction.