Patents by Inventor Stephane Morel

Stephane Morel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11753085
    Abstract: An assembly of an aluminum-based part and a press hardened steel part provided with an alloyed coating including in weight percent, 0.1 to 15.0% silicon, 15.0 to 70% of iron, 0.1 to 20.0% of zinc, 0.1 to 4.0% of magnesium, the balance being aluminum, on at least one of the surfaces thereof placed so as to be in contact with the aluminum-based part.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: September 12, 2023
    Assignee: ArcelorMittal
    Inventors: Tiago Machado Amorim, Stephane Morel, Laurence Dosdat, Astrid Gregoire
  • Publication number: 20220177051
    Abstract: An assembly of an aluminum-based part and a press hardened steel part provided with an alloyed coating including in weight percent, 0.1 to 15.0% silicon, 15.0 to 70% of iron, 0.1 to 20.0% of zinc, 0.1 to 4.0% of magnesium, the balance being aluminum, on at least one of the surfaces thereof placed so as to be in contact with the aluminum-based part.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 9, 2022
    Inventors: Tiago MACHADO AMORIM, Stephane MOREL, Laurence DOSDAT, Astrid GREGOIRE
  • Publication number: 20150298260
    Abstract: The invention concerns a method for marking a surface (S) by laser treatment, consisting of etching a plurality of patterns (M(0), M(1)) onto the surface by means of a laser source (2), said patterns being distributed across the surface according to a predefined tessellation of adjacent patterns, which involves: —etching each pattern from a corresponding virtual image generated in an image plane (20) of the laser source and physically reproduced by laser etching on the surface, in which each virtual image defines a frame physically reproduced on an area of the surface such that the corresponding etched pattern has an etched frame covering said area, the etched frames of adjacent patterns covering adjacent areas; and —the laser source is controlled in position between each etching of a pattern by means of a three-dimensional surface mapping system (3) coupled to the laser source; the method being remarkable in that it involves resetting the laser source, before etching each pattern, by matching up hook element
    Type: Application
    Filed: November 26, 2013
    Publication date: October 22, 2015
    Inventor: Stephane MOREL
  • Patent number: 8375995
    Abstract: A protective device for a male end of a component of a threaded tubular connection for drilling and working hydrocarbon wells is externally provided with at least one threading and includes a free terminal portion. The device includes i) a protector body produced in the form of a first sleeve and arranged to protect at least a portion of the external threading and the free terminal portion, ii) a sealing element for positioning in contact firstly with the component, at least at a portion located downstream of the external threading of the male end, and secondly with the protector body to provide a first seal downstream of the external threading, and iii) a fixing mechanism displacing the sealing element and/or protector body radially towards the component, defining open and closed positions of the device in which the sealing element and/or the protector body are respectively not in contact and in tight contact with the component. Further, the first seal is obtained in the closed position of the device.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: February 19, 2013
    Assignees: Vallourec & Mannesmann Oil & Gas France, Vam Mexico SA de CV
    Inventors: Sebastien Courtois, Stephane Morel, Erwan Cadiou, Roque Velasquez
  • Patent number: 8138087
    Abstract: An integrated circuit is provided that comprises a substrate of silicon and an interconnect in a through-hole extending from the first to the second side of the substrate. The interconnect is coupled to a metallization layer on the first side of the substrate and is provided on an amorphous silicon layer that is present at a side wall of the through-hole, and particularly at an edge thereof adjacent to the first side of the substrate. The interconnect comprises a metal stack of nickel and silver. A preferred way of forming the amorphous silicon layer is a sputter etching technique.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: March 20, 2012
    Assignee: NXP B.V.
    Inventors: Stephane Morel, Arnoldus Den Dekker, Elisabeth C. Rodenburg, Eric C. E. Van Grunsven
  • Publication number: 20100089484
    Abstract: A protective device for a male end of a component of a threaded tubular connection for drilling and working hydrocarbon wells is externally provided with at least one threading and includes a free terminal portion. The device includes i) a protector body produced in the form of a first sleeve and arranged to protect at least a portion of the external threading and the free terminal portion, ii) a sealing element for positioning in contact firstly with the component, at least at a portion located downstream of the external threading of the male end, and secondly with the protector body to provide a first seal downstream of the external threading, and iii) a fixing mechanism displacing the sealing element and/or protector body radially towards the component, defining open and closed positions of the device in which the sealing element and/or the protector body are respectively not in contact and in tight contact with the component. Further, the first seal is obtained in the closed position of the device.
    Type: Application
    Filed: December 14, 2007
    Publication date: April 15, 2010
    Applicants: Vallourec Mannesmann Oil & Gas France, Vam Mexico SA DE CV Av. Framboyanes-Lote 6 Manzana 5 Cd.
    Inventors: Sebastien Courtois, Stephane Morel, Erwan Cadiou, Roque Velasquez
  • Publication number: 20090267232
    Abstract: An integrated circuit (100) is provided that comprises a substrate (140) of silicon and an interconnect (130) in a through-hole extending from the first to the second side of the substrate. The interconnect is coupled to a metallisation layer (120) on the first side of the substrate and is provided on an amorphous silicon layer that is present at a side wall of the through-hole, and particularly at an edge thereof adjacent to the first side of the substrate. The interconnect comprises a metal stack of nickel and silver. A preferred way of forming the amorphous silicon layer is a sputter etching technique.
    Type: Application
    Filed: September 17, 2007
    Publication date: October 29, 2009
    Applicant: NXP, B.V.
    Inventors: Stephane Morel, Arnoldus Den Dekker, Elisabeth C. Rodenburg, Eric C. E. Van Grunsven