Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: The embodiments of this invention relate to a smart card (1) comprising the following:—an integrated circuit chip (10),—a primary card body (3) with a first form factor, comprising a slot (5) on the front (7) designed to accommodate the integrated circuit chip (10), wherein the said primary card body (3) also comprises a detachable contour (c1), peripheral to the slot (5), which represents another form factor and defines a secondary card body (11), characterised in that the primary card body (3) has a first thickness (el), between the front (7) and a back (8), and in that the secondary card body (11) has a second thickness (e2), between a front (7, 12) and a back (14), which is smaller than the first thickness (el).

Abstract: The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (1) comprising at least one integrated circuit chip (10) which is connected to the conductor tracks of an insulating support and at least one light-emitting diode (16). According to one aspect of the invention, the assembly formed by the integrated circuit (10) and the light-emitting diode (16) is coated with a translucent resin (32), thereby forming an element for the mechanical protection of the assembly and for the transmission of the light emitted by the diode (16). According to another aspect of the invention, the coated assembly comprises at least one indicator light (LED) and a radio-frequency coil (preferably in the module).

Abstract: The invention relates to an electronic device comprising a module which is affixed to a support body by means of a layer of adhesive. According to the invention, the module comprises a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film. The invention is characterised in that the device comprises a primer separation layer (9, 14) which is disposed between the lower face (10) and the chip (8). The invention is also characterised in that the primer separation layer adheres more to the adhesive layer than the film. The invention also relates to the associated modules.

Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.