Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the first side part being separated from the module-receiving part by a first separation line (6), and a second side part (5) coupled to the module-receiving part (3), the second side part being separated from the module-receiving part by a second separation line (7). The module-receiving part defines a third shape corresponding to a third card body (3) type when the first (4) and second (5) side parts are detached from the module-receiving part (3). The module-receiving part defines a second shape (2) corresponding to a second card body type when the first (4) and second (5) side parts are coupled to the module-receiving part (3).

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the first side part being separated from the module-receiving part by a first separation line (6), and a second side part (5) coupled to the module-receiving part (3), the second side part being separated from the module-receiving part by a second separation line (7). The module-receiving part defines a third shape corresponding to a third card body (3) type when the first (4) and second (5) side parts are detached from the module-receiving part (3). The module-receiving part defines a second shape (2) corresponding to a second card body type when the first (4) and second (5) side parts are coupled to the module-receiving part (3).

Abstract: A method comprising the steps of depositing an RF component (11) onto the top surface of a first sheet-like substrate (10), depositing an antenna (12, 13) connected to the RF component (11) onto the top surface of the first substrate (10), depositing a second substrate (14) onto the top surface of the first substrate (10) to cover at least the RF component (11) and the antenna (12, 13), and laminating the resulting assembly to give a unitary assembly having a substantially uniform thickness.

Abstract: The invention concerns a method of manufacturing a module intended to create a portable object with chip and antenna. The portable object comprises an antenna and a chip placed on an insulating substrate. The antenna comprises a plurality of turns. The method comprises a first step in which an insulating substrate with at least one side is provided. The method is characterised in that it further comprises a second step in which an individual housing opening in the said side is made for each of the said turns and a third step in which said antenna comprising a plurality of turns is made by placing a conducting material in each individual housing.

Abstract: The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).

Abstract: The invention concerns a method of manufacturing a module (24) intended to create a portable object with chip and antenna (36). The portable object comprises an antenna (20, 20a, 20b, 20c) and a chip (18) placed on an insulating substrate (10). The antenna (20, 20a, 20b, 20c) comprises a plurality of turns (14). The method comprises a first step in which an insulating substrate (10) with at least one side (10′) is provided. The method is characterised in that it further comprises a second step in which an individual housing (12, 12a, 12b, 12c) opening in the said side (10′) is made for each of the said turns (14) and a third step in which said antenna (20, 20a, 20b, 20c) comprising a plurality of turns (14) is made by placing a conducting material (20a, 20b, 20c) in each individual housing (12, 12a, 12b, 12c).

Abstract: The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).

Abstract: The present invention relates to an integrated circuit having an active face (2) with terminal pads (3) therein and an inactive face (4) opposite from the active face. Respective reinforcing sheets (5, 6) cover the faces of the integrated circuit. The invention also provides a method of reinforcing integrated circuits.