Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: The invention relates to a method and apparatus to use nitrogen, or any other inert gas, or a reducing gas as a process gas to reflow and planarize solder paste in a single heating step. The inert gas may also be used to cool the solder paste after reflowing. According to one method soldered paste is printed onto the printed circuit board with conventional methods employing a mask or stencil. A mesh, die, or mold element having a plurality of openings therein is lowered onto the soldered paste and the printed circuit board is reflowed and planarized in a single heating step. Once the paste is applied, the parts are reflowed and planarized in a single, brief, thermal excursion. The heated mesh is lowered into the solder paste causing the paste to wick through the mesh forming a meniscus. A hot gas knife is arranged to plane the meniscus of the solder paste off of the mesh. An inert, nitrogen, or reducing gas is diffused through the knife to prevent oxidation.

Abstract: In this process for dry surface treatment of at least one surface portion of an object, a gas is passed through an instrument for forming excited or unstable gas species, and said surface portion is brought in front of the outlet of said device with a view to treating it with said excited or unstable gas species, the secondary gas delivered as outlet from the instrument being subsequently taken in again by the Venturi effect and reinjected into the instrument.

Abstract: The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable species and being substantially free of electrically charged species, which is obtained from a primary gas mixture and, optionally, an adjacent gas mixture, the primary gas mixture being obtained at the gas outlet of at least one apparatus for forming excited or unstable gas species, in which an initial gas mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent gas mixture not having passed through the apparatus.

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract: The invention relates to a process for the dry surface treatment of at least one metal surface portion, according to which the portion is treated at a pressure close to atmospheric pressure by a gaseous treatment atmosphere comprising excited or unstable species and substantially devoid of electrically charged species, obtained from a primary gaseous mixture and if necessary an adjacent gaseous mixture, the primary gaseous mixture being obtained at the gas outlet of at least one device for the production of excited or unstable gaseous species, in which an initial gaseous mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent mixture not having passed through the device.

Abstract: A method for dry fluxing at least one metallic surface of an article comprising the steps of:a) passing at least one initial gas mixture comprising (1) at least one of an inert gas and a reducing gas and (2) an oxidizing gas mixture comprising water vapor into at least one apparatus for forming excited or unstable gas species, the initial gas mixture including 50 ppm to 6% water vapor;b) converting the at least one initial gas mixture to at least one primary gas mixture comprising excited or unstable gas species; andc) treating the surface to be fluxed, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable gas species and substantially free of electrically charged species obtained from the primary gas mixture.

Abstract: A gas excitation device, comprisinga gas excitation chamber comprising a gas inlet passage defining a path of gas in communication with a primary gas supply sources, an outlet passage for excited gas, a venturi-effect constriction arranged on the path of the gas between the primary supply source and the inlet passage, and at least one secondary gas supply source in communication with a region located downstream of the constriction, the gas delivered by the secondary source being entrained by venturi effect into the excitation chamber under the effect of the gas delivered by the primary source.

Abstract: A method of forming a gaseous treatment atmosphere capable of depositing a silicon on a metal substrate comprising the steps of:converting an initial gas mixture into a primary gas mixture in an apparatus for forming excited or unstable gas species, the primary gas mixture comprising excited or unstable gaseous species substantially devoid of electrically charged species,combining the primary gas mixture with an adjacent gas mixture which comprises at least one silicon precursor gas and which has not passed through the apparatus, to form the gaseous treatment atmosphere.

Abstract: A method of forming a gaseous treatment atmosphere capable of depositing a silicon-containing film on a nonmetallic substrate comprising the steps of:converting an initial treatment gas mixture into a primary treatment gas mixture in an apparatus for forming excited or unstable gas species, the primary treatment gas mixture comprising excited or unstable gaseous species substantially devoid of electrically charged species,combining the primary treatment gas mixture with an adjacent treatment gas mixture which comprises at least one gaseous silicon precursor which has not passed through the apparatus, to form the gaseous treatment atmosphere.

Abstract: A method for wave soldering a circuit having two or more faces comprising the steps of:(i) passing at least one initial gas mixture comprising at least one of an inert gas, a reducing gas and an oxidizing gas into at least one apparatus for forming excited or unstable gas species;(ii) converting the at least one initial gas mixture into at least one primary gas mixture comprising excited or unstable gas species and substantially free of electrically charged species;(iii) treating each of the two or more faces of the circuit with the at least one primary gas mixture at a pressure close to atmospheric pressure; and(iv) contacting the two or more faces of the circuit with at least one wave of a liquid soldering alloy.