Patents by Inventor Stephane Vanier

Stephane Vanier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated dicing tool for semiconductor substrate materials
    Patent number: 7559446
    Abstract: An apparatus for subdividing a sheet of brittle insulating material with a plurality of semiconductor chips disposed thereon. The chips are separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the sheet in a flexible conformable carrier having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet and forcing the sheet against an arched anvil, thereby fracturing the sheet along the scribe lines.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: July 14, 2009
    Assignee: International Business Machines Corporation
    Inventors: Pierre-Luc Duchesne, Pierre Laroche, Nicolas Tessier, Roch Thivierge, Stephane Vanier
  • AN AUTOMATED DICING TOOL FOR SEMICONDUCTOR SUBSTRATE MATERIALS
    Publication number: 20060143908
    Abstract: A method and an apparatus for subdividing a sheet of brittle insulating material (a silicon wafer substrate) with a plurality of semiconductor chips disposed thereon and electrically bonded to respective underlying circuit blocks printed on the sheet to provide each chip with its own substrate. The chips are arranged in rows and columns separated by row and column kerfs each of which contains a respective scribed line.
    Type: Application
    Filed: December 22, 2005
    Publication date: July 6, 2006
    Inventors: Pierre-Luc Duchesne, Pierre Laroche, Nicolas Tessier, Roch Thivierge, Stephane Vanier