Abstract: An etch apparatus is presented including a grounding mechanism which maintains a low resistance electrical ground path between a plate electrode and a chamber despite temperature variations. The etch apparatus includes a chamber having a removable upper housing, a plate electrode positioned within the upper housing, and a grounding mechanism positioned between the plate electrode and the upper housing such that it contacts both the plate electrode and the upper housing. The grounding mechanism electrically couples the plate electrode to the upper housing. Several embodiments of the grounding mechanism include at least one sheet of metal folded to form two sections extending in an acute angle relative to one another. In two embodiments, the folded sheet of metal forms two sections meeting at a crease. Each of the two sections has an outer edge opposite the crease.

Abstract: A fabrication clean room work station is portable and has a funnel-shaped cleaning area which is connected to a vacuum source through a bottom opening. The work station also has a perforated cover positioned across a top opening of the cleaning area to provide a work surface, a catch screen positioned across the bottom opening of the cleaning area to catch dropped parts, a funnel cover which slides over the cleaning area to enclose it, and a flexible tubing in communication with a port formed in the cleaning area. The port is positioned above the catch screen so that any parts vacuumed through the flexible tubing would be stopped by the catch screen. The vacuum source supplies vacuum at the work surface and at the flexible tubing. The vacuum at the flexible tubing is increased when the funnel cover is positioned above the cleaning area.