Patents by Inventor Stephanie Allard

Stephanie Allard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11164804
    Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: November 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas Brunschwiler, Stephanie Allard, Kenneth C. Marston, Marcus E. Interrante
  • Patent number: 11152226
    Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: October 19, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin Drummond, Thomas Lombardi, Steve Ostrander, Stephanie Allard, Catherine Dufort
  • Publication number: 20210242098
    Abstract: Chip pairs in a semiconductor module have a spacing between them that forms a spacing region. A lid has a lid bottom side and one or more feet. The feet protrude from a periphery of the lid bottom side. A sealband adhesive has a sealband adhesive thickness and adheres the feet to a substrate so the chip pairs are under the lid bottom side and back sides of the chips are in thermal contact with the lid bottom side. A variable thickness lid adhesive connects the substrate in the spacing region to the lid bottom side. The variable thickness lid adhesive has a lid adhesive thickness that is greater than the sealband adhesive thickness by a delta thickness amount. In some embodiments, the lid also has a shortened central lid rib with a bottom. The shorten central lid rib protrudes an extension distance from the lid bottom side into the spacing region. In these embodiments, the variable thickness lid adhesive connects the substrate in the spacing region to the bottom.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 5, 2021
    Inventors: Tuhin Sinha, Stephanie Allard, Jean Labonte
  • Publication number: 20210111039
    Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Inventors: Kevin Drummond, Thomas Lombardi, Steve Ostrander, Stephanie Allard, Catherine Dufort
  • Publication number: 20210111093
    Abstract: An integrated circuit (IC) module includes a carrier and multiple IC devices. A heterogenous seal band connects a lid to the carrier. A perimeter wall of the lid is joined to a low modulus seal band and an inner wall of the lid is joined to a high modulus seal band. The low modulus seal band is located around the perimeter of the lid and a perimeter of the multiple IC devices. The high modulus seal band is located between the multiple IC devices. The low modulus seal band has a low resistance to being deformed elastically and the high modulus seal band has a high resistance to being deformed elastically. The low modulus seal band allows for dimensional fluctuations between the lid and carrier. The high modulus seal band allows for adequate joining of the lid and the carrier with relatively less seal band material.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 15, 2021
    Inventors: Tuhin Sinha, Stephanie Allard, Jean Labonte, Shidong Li
  • Publication number: 20210028079
    Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.
    Type: Application
    Filed: July 23, 2019
    Publication date: January 28, 2021
    Inventors: Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas Brunschwiler, Stephanie Allard, Kenneth C. Marston, Marcus E. Interrante
  • Patent number: 9219051
    Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: December 22, 2015
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet
  • Publication number: 20140359996
    Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.
    Type: Application
    Filed: June 5, 2013
    Publication date: December 11, 2014
    Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet