Abstract: Methods of sealing a venthole of a micromechanical device. The venthole leads to a chamber that contains a device. A first laser pulse is applied to the venthole of a substrate of the micromechanical device for a first time period. The first laser pulse has a first laser intensity spatial distribution. Thereafter, a second laser pulse is applied to the venthole for a second time period. The second laser pulse has a second laser intensity spatial distribution that is different than the first laser intensity spatial distribution. The second laser pulse can be applied for a time that is different than that of the first laser pulse.

Abstract: A venthole of a micromechanical device is sealed with laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface, and defines a venthole leading to a chamber that contains a device, and a trench extending downward from the upper surface and located offset from the venthole. A laser pulse is applied to the substrate at or within the trench. This causes a portion of the substrate located below the upper surface to melt and travel laterally to close off and seal the venthole laterally from beneath the upper surface.

Abstract: A computer-implemented method for operating a laser material processing machine. An estimated result is ascertained as a function of predefined process parameters, which characterize how good an actual result of the laser material processing will be, and the process parameters are varied by means of Bayesian optimization with the aid of a data-based model, until an actual result of the laser material processing is sufficient enough.

Abstract: A venthole of a micromechanical device is sealed with laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface, and defines a venthole leading to a chamber that contains a device, and a trench extending downward from the upper surface and located offset from the venthole. A laser pulse is applied to the substrate at or within the trench. This causes a portion of the substrate located below the upper surface to melt and travel laterally to close off and seal the venthole laterally from beneath the upper surface.

Abstract: A computer-implemented method for operating a laser material processing machine. An estimated result is ascertained as a function of predefined process parameters, which characterize how good an actual result of the laser material processing will be, and the process parameters are varied by means of Bayesian optimization with the aid of a data-based model, until an actual result of the laser material processing is sufficient enough.