Abstract: New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion.

Abstract: New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.

Abstract: A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four processor boards. A printed circuit board is provided with conductive apertures and portions corresponding to an efficient Packaging allowing for the attachment of the processor-chip on one side of the printed circuit board, and the HUB and other supporting electronic components on the other side of the printed circuit board. This configuration allows for the close spacing of the electrical conductors of the HUB and the processors without the limitations imposed by the physical dimensions of the respective hardware. Additionally, a symmetric packaging of the conductive apertures and portions about a centerline of the printed circuit board allows for a simple design modification to allow for a two two-processor board to be manufactured from a similarly configured four-processor board.

Abstract: An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs.

Abstract: An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.

Abstract: The present invention discloses a method and apparatus for conductively transferring heat away from electrical devices located on daughter boards attached to mother boards. The preferred method involves the steps of conductively transferring heat from each electrical device to a conductive layer located within the daughter board, transferring heat from the conductive layer within the daughter board to a conductive structure located on the surface of the daughter board, and transferring heat from the conductive structure to a cooling surface located on the cold plate. The preferred apparatus includes a mother board, a cold plate adjacent the mother board and attached to the mother board, a daughter board with an electrical device attached thereto, the daughter board attached to the mother board opposite the cold plate. The daughter board lies in a plane which is adjacent and substantially parallel to the plane of the mother board.

Abstract: A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.

Abstract: A circuit board module for a supercomputer includes quick connections for power, ground, coolant quick connects, and circuit quick connects. The quick connections provide for insertion of modules with substantial savings in time and effort. The electrical power and ground connections and the liquid coolant connections engage and disengage automatically upon insertion and removal of the modules. The circuit quick connects require only insertion of a camming tool for connection and disconnection. The modules require no bolting or unbolting of clamps or hoses for the various connections.

Abstract: An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).

Abstract: An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.

Abstract: A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.

Abstract: An electrical edge connector (14) of the zero insertion force type includes a pair of opposing blocks (30, 32) defining a longitudinal guideway (34) therebetween. Opposite corresonding pairs of female contacts (52, 54) are disposed in transverse holes in the blocks (30, 32), and male contacts (60) are slidably supported in the female contacts in one block for selective actuation into or out of sliding engagement with the female contacts in the other block responsive to insertion of a slider (36).