Abstract: For use with an electronics chassis having a chassis plug mounted to a wall thereof, a retention bracket for securing an outlet end of a line cord to the chassis plug and methods of operating and manufacturing the same. In one embodiment, the bracket includes: (1) a strap that defines a receiver for accepting and surrounding a body of the outlet end, the strap terminating in first and second locking members projecting radially from the receiver and having corresponding alignable first and second strap apertures and (2) first and second chassis anchors projecting from the strap in a direction substantially parallel to a centerline of the receiver, the outlet end engageable with the chassis plug, the first and second chassis anchors lockable with the wall via corresponding chassis apertures therein, a brace projecting from the wall and having a brace aperture aligning with the first and second strap apertures.

Abstract: A housing for a power supply rectifier includes an enclosure having front and rear panels, top and bottom walls, and side walls. A bracket is attached to the enclosure and includes a plurality of projections for mating with a plurality of apertures contained in one or more of the walls of the enclosure. The projections are larger than the apertures, such that when pressure is applied to the bracket, the projections are forced into the apertures to form a seal to minimize EMI emissions from the enclosure. The bracket removably mounts a fan to the housing.

Abstract: The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.

Abstract: The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.