Abstract: The invention comprises a connector apparatus for electrically interconnecting a chip sub-assembly to an optical sub-assembly. The apparatus includes a connector sleeve with a chip sub-assembly having at least one electrical connection arranged thereon. The connector sleeve is suitable for receiving a connector plug that includes an optical fiber optically coupled to the photonic devices of an optical sub-assembly that includes electrical connectors. The connector plug is engaged with the connector sleeve, thereby electrically interconnecting the electrical connections of the chip sub-assembly to the electrical connectors of the optical sub-assembly such that electrical signals can pass between the chip sub-assembly and a photonic device of the optical sub-assembly.

Abstract: An integrated circuit device comprising a semiconductor die having a plurality of conductive pads. Over the conductive pads is formed a passivation layer that has a plurality of passivation layer openings. The passivation layer openings are positioned over an associated one of the conductive pads. Barrier base pads are placed in electrical contact with the conductive pads such that a portion of each of barrier base pads cover at least the perimeter of each passivation layer opening. Each of the barrier base pads prevents cracks from propagating through the integrated circuit device. In another aspect of the invention, the integrated circuit device is attached to an external substrate by connecting the contact bumps to the bond pads on an electronic substrate. In yet another aspect of the invention, a method for manufacturing the integrated circuit device is described.