Abstract: A socket for dual in line package integrated circuits has a high retention force for a correspondingly low insertion force. Each of a plurality of contacts in a dielectric housing bends relatively easily as a lead of such package is inserted and as such insertion is completed the contact assumes a residual position for good electrical and mechanical connection to the lead. Friction between the lead and contact effects movement of the latter to change the geometry thereof as the former is withdrawn, whereby the contact binding force against lead increases to increase the force required for completion of such withdrawal.