Patents by Inventor Stephen Abraham

Stephen Abraham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140229390
    Abstract: A system for providing users with wedding planning tools via a network, comprising one or more servers for executing an application that provides code to a user's client computer for display on the user's client computer of various web pages for planning an event. The web pages comprising a signup page configured to allow the user to sign up to gain access to the system, a plurality of design pages configured to allow the user to design a plurality of different items relating to the event including at least an invitation to the event, and a plurality of layout pages configured to allow the user to plan the arrangement of tables at the event and assign seating for a plurality of guests that are anticipated to attend the event.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 14, 2014
    Inventors: Stephen Abraham Morris, Bei Yang
  • Publication number: 20070224917
    Abstract: A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.
    Type: Application
    Filed: March 27, 2006
    Publication date: September 27, 2007
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Brian Bottema, Stephen Abraham, Alex Pamatat
  • Publication number: 20070054601
    Abstract: A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the platen (130) includes one or more passageways (132) that provide a pathway to ambient or sub-ambient environment. The combination of the sealing region (131) and the passageway(s) (132) prevent liquids, vapors or other undesirable contaminants from infiltrating between the pad and platen, and also vent trapped air pockets between the pad and platen.
    Type: Application
    Filed: September 6, 2005
    Publication date: March 8, 2007
    Inventors: Brian Bottema, Stephen Abraham, Alex Pamatat
  • Publication number: 20070054602
    Abstract: A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air pressure buildup in the air gap (46) by discharging or venting air through one or more vent pathways (52) formed in the platen to provide a pathway to ambient or sub-ambient environment. The air permeable construction of the vented endpoint window (72) provides pressure relief for the air gap (46) between the pad endpoint window (44) and the vented endpoint window (72), but may also include passages (75, 76) that are filled with an air permeable hydrophobic material which protects the underlying endpoint detection system (30, 32) from contamination during cleaning of the platen endpoint window (72).
    Type: Application
    Filed: September 6, 2005
    Publication date: March 8, 2007
    Inventors: Brian Bottema, Stephen Abraham, Alex Pamatat