Patents by Inventor Stephen Andrew Langanke

Stephen Andrew Langanke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatsink secured to a heat source
    Patent number: 10937717
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Michael Aaron Schroeder, Stephen Andrew Langanke
  • HEATSINK SECURED TO A HEAT SOURCE
    Publication number: 20190230820
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Applicant: Intel Corporation
    Inventors: Michael Aaron Schroeder, Stephen Andrew Langanke