Patents by Inventor Stephen Andrew Smith

Stephen Andrew Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit structures in package substrates
    Patent number: 11804426
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: October 31, 2023
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
    Publication number: 20210351116
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 11, 2021
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Integrated circuit structures in package substrates
    Patent number: 11107757
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
    Publication number: 20200251411
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • Integrated circuit structures in package substrates
    Patent number: 10672693
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
  • INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
    Publication number: 20190304887
    Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
    Type: Application
    Filed: April 3, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang