Abstract: A vacuum clean-out system including a separator chamber and associated collection chamber for removing liquid material and debris from a vacuum output and providing a vacuum return line free of contaminants. A vacuum exhaust line is coupled to a cyclonic separator chamber that induces a circular rotation within the incoming vacuum stream, causing the liquid and debris to impinge the chamber's surfaces and fall to the bottom thereof while the “clean” vacuum is drawn upwards into a return line. The collection chamber is maintained at the same negative pressure as the separator chamber so that the accumulating liquid and debris easily drains into the collection chamber. A sensor associated with the collection chamber may be used to determine when the collection chamber is full and needs to be discharged. At that point, the separator chamber is isolated from the collection chamber, the collection chamber is vented and the accumulated material is discharged and/or analyzed.

Abstract: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port, the apparatus may also include self-contained flushing means and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditioning disk to the arm, while also providing a “quick release” mechanism for maintenance operations. The enhanced arm also includes an improved actuator that provides for a static friction (“stiction”)-free movement of the arm and better control of the downforce applied by the conditioning disk to the polishing pad. A dual-drive pulley system is used within the enhanced end effector arm to minimize the tilting of the drive belts within the effector arm as the arm pivots to follow the contour of an “aging” polishing pad.

Abstract: An apparatus for conditioning the polishing pad of a chemical mechanical planarization (CMP) system including an apertured conditioning disk that is formed to support a plurality of brush bristles in any desired configuration. The bristles are utilized to lift out debris and contaminants that have been lodged within the deep pores of polishing pads, particularly “soft” polishing pads (or polishing felts) that include relatively deep pores. The apertures in the conditioning disk are used to allow for the efficient evacuation of the effluent created during the conditioning process. The apertures may also be used to introduce conditioning fluids as the bristles are brushing the surface to assist in the conditioning process. The utilization of the apertures to evacuate the effluent (via an attached vacuum source) overcomes problems associated with the prior art by immediately removing the dislodged material from the pad surface before it has an opportunity to be re-incorporated into the polishing pad.

Abstract: A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditioning disk to the arm, while also providing a “quick release” mechanism for maintenance operations. The enhanced arm also includes an improved actuator that provides for a static friction (“stiction”)-free movement of the arm and better control of the downforce applied by the conditioning disk to the polishing pad. A dual-drive pulley system is used within the enhanced end effector arm to minimize the tilting of the drive belts within the effector arm as the arm pivots to follow the contour of an “aging” polishing pad.

Abstract: An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slurry from the surface of the polishing pad. By presenting a clean, virtually “new” polishing pad surface at the beginning of each planarization cycle, polishing agents of different chemistries, morphologies, temperatures, etc. may be used without the need to remove the wafer to change the polishing source or transfer the wafer to another CMP polishing station. A multi-positional valve may be used to control the introduction of various process fluids, including a variety of different polishing slurries and conditioning/flushing agents. The use of different conditioning materials allows for the surface of the polishing pad to be altered for different process conditions (e.g.

Abstract: A system and method for providing process control in a CMP system utilizes a vacuum-assisted arrangement for conditioning a wafer polishing pad so that the effluent (i.e., wafer debris, polishing slurry, chemical or other by-products) from the conditioning process is diverted from the waste stream and instead introduced into an analysis module for further processing. The analysis module functions to determine at least one parameter within the effluent and generate a process control signal based upon the analysis. The process control signal is then fed back to the planarization process to allow for the control of various parameters such as polishing slurry composition, temperature, flow rate, etc. The process control signal can also be used to control the conditioning process and/or determining the endpoint of the planarization process itself.