Patents by Inventor Stephen Bodiley

Stephen Bodiley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatsink for a memory and routing module
    Patent number: 12588501
    Abstract: A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 24, 2026
    Assignee: GRAPHCORE LIMITED
    Inventors: Stephen Bodiley, David Japp, Stephen Felix
  • Heatsink for a Memory and Routing Module
    Publication number: 20230282539
    Abstract: A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 7, 2023
    Inventors: Stephen BODILEY, David JAPP, Stephen FELIX
  • Tape deployment systems and methods of deploying tape in digital data transfer apparatus
    Patent number: 7502198
    Abstract: A tape deployment system for a digital data transfer apparatus includes a tape guide movable from a non-deployed position to a plurality of deployed positions and a cam arrangement for determining the deployed position to which the tape guide moves.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: March 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hugo W Maule, Stephen Bodiley
  • Tape deployment systems and methods of deploying tape in digital data transfer apparatus
    Publication number: 20070086110
    Abstract: A tape deployment system for a digital data transfer apparatus includes a tape guide movable from a non-deployed position to a plurality of deployed positions and a cam arrangement for determining the deployed position to which the tape guide moves.
    Type: Application
    Filed: July 21, 2006
    Publication date: April 19, 2007
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Hugo Maule, Stephen Bodiley