Abstract: A settling basin insert for controlling fluid flow into a settling basin has a first and second side wall in opposition, and a top surface extending between the first and second side walls, defining a sump extending from head to end. Fluid apertures extend through the top surface to permit fluid to communicate with the sump and an access aperture in the top surface permits a vacuum hose to pass into the sump. The first side wall is taller than the second side wall, and the first and second side walls each define a guide wall extending above the top surface. The second side wall is configured to be adjacent the settling basin. The first and second side walls direct inflowing fluid along the settling basin insert and through the fluid apertures in the top surface, decelerating the fluid for settling of sediment in the settling basin insert.

Abstract: A settling basin insert for controlling fluid flow into a settling basin has a first and second side wall in opposition, and a top surface extending between the first and second side walls, defining a sump extending from head to end. Fluid apertures extend through the top surface to permit fluid to communicate with the sump and an access aperture in the top surface permits a vacuum hose to pass into the sump. The first side wall is taller than the second side wall, and the first and second side walls each define a guide wall extending above the top surface. The second side wall is configured to be adjacent the settling basin. The first and second side walls direct inflowing fluid along the settling basin insert and through the fluid apertures in the top surface, decelerating the fluid for settling of sediment in the settling basin insert.

Abstract: A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.

Abstract: A baffle insert is disclosed for a catch basin having a sump, a plurality of walls defining a passage to the sump, and an outlet. The insert comprises a ramp for positioning in the passage to partially occlude the passage and direct inflowing fluid downwardly and toward a wall of the basin. A grate is positioned below the ramp to intercept fluid falling from the ramp and direct it toward the basin outlet. The grate forms a barrier above the sump and has a plurality of apertures for permitting fluid to communicate with the sump. The ramp and the grate mounted to an post that rests on the bottom of the sump. The post is extendible to adjust the heights of the ramp and the grate above the sump.

Abstract: A baffle insert is disclosed for a catch basin having a sump, a plurality of walls defining a passage to the sump, and an outlet. The insert comprises a ramp for positioning in the passage to partially occlude the passage and direct inflowing fluid downwardly and toward a wall of the basin. A grate is positioned below the ramp to intercept fluid falling from the ramp and direct it toward the basin outlet. The grate forms a barrier above the sump and has a plurality of apertures for permitting fluid to communicate with the sump. The ramp and the grate mounted to an post that rests on the bottom of the sump. The post is extendible to adjust the heights of the ramp and the grate above the sump.

Abstract: A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.