Patents by Inventor Stephen Buchwalter
Stephen Buchwalter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10833120Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: GrantFiled: September 23, 2019Date of Patent: November 10, 2020Assignee: International Business Machines CorporationInventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
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Publication number: 20200020738Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: ApplicationFiled: September 23, 2019Publication date: January 16, 2020Inventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
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Patent number: 10490594Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: GrantFiled: October 14, 2016Date of Patent: November 26, 2019Assignee: International Business Machines CorporationInventors: Lawrence Jacobwitz, Stephen Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
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Publication number: 20170033153Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: ApplicationFiled: October 14, 2016Publication date: February 2, 2017Inventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
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Patent number: 9490408Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: GrantFiled: September 13, 2013Date of Patent: November 8, 2016Assignee: International Business Machines CorporationInventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
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Publication number: 20140084314Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: ApplicationFiled: September 13, 2013Publication date: March 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter A/ Gruber, Da-Yuan Shih
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Publication number: 20070246252Abstract: A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.Type: ApplicationFiled: April 18, 2006Publication date: October 25, 2007Applicant: International Business Machines CorporationInventors: Stephen Buchwalter, Russell Budd
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Publication number: 20070029277Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.Type: ApplicationFiled: August 2, 2005Publication date: February 8, 2007Applicant: International Business Machines CorporationInventors: Lawrence Jacobowitz, Stephen Buchwalter, Casimer DeCusatis, Peter Gruber, Da-Yuan Shih
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Publication number: 20060289607Abstract: A method for constructing a composite solder transfer moldplate for flip chip wafer bumping of a substrate, comprising the steps of coating at least one polymer layer onto a first side of a transparent plate, the plate having a thermal expansion coefficient similar to that of the substrate; and forming a multiplicity of cavities in a polymer layer on one side of the plate, each cavity being for receiving solder. A moldplate made by the method. The structure has required behavior through temperature excursions between room temperature and various solder molten temperatures.Type: ApplicationFiled: June 28, 2005Publication date: December 28, 2006Inventors: Stephen Buchwalter, David Danovitch, Frank Egitto, Peter Gruber, Eric Perfecto, Da-Yuan Shih
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Publication number: 20060177568Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: ApplicationFiled: February 4, 2005Publication date: August 10, 2006Applicant: International Business Machines CorporationInventors: Gareth Hougham, Leena Buchwalter, Stephen Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey Gelorme, Kathleen Hinge, Anurag Jain, Sung Kang, John Knickerbocker
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Publication number: 20060118604Abstract: Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.Type: ApplicationFiled: December 5, 2004Publication date: June 8, 2006Inventors: Stephen Buchwalter, Claudius Feger, Peter Gruber, Sung Kang, Paul Lauro, Da-Yuan Shih
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Publication number: 20050263571Abstract: A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.Type: ApplicationFiled: May 30, 2004Publication date: December 1, 2005Inventors: Luc Belanger, Guy Brouillette, Stephen Buchwalter, Peter Gruber, Hideo Kimura, Jean-Luc Landreville, Frederic Manurer, Marc Montminy, Valerie Oberson, Da-Yuan Shih, Stephane St-Onge, Michel Turgeon, Takeshi Yamada
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Publication number: 20050250248Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled miocroelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.Type: ApplicationFiled: June 15, 2005Publication date: November 10, 2005Inventors: Stephen Buchwalter, Claudius Feger, Gareth Hougham, Nancy LaBianca, Hosadurga Shobha
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Publication number: 20050168947Abstract: The invention is directed to structure and methods of improving the cooling capacity of chip packaging modules. The chip packaging module has a substrate with thin-film wiring on one side and grooves or channels etched on one or both sides where coolant pumps are embedded. The coolant pumps are used to enhance the liquid flowing inside the module. The coolant flows through the chips within the vias in the chips or around the chips when the chips do not have vias. Both cooling modes, single or two-phase modes can be adopted in the module.Type: ApplicationFiled: December 11, 2003Publication date: August 4, 2005Inventors: Lawrence Mok, Leena Buchwalter, Stephen Buchwalter
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Patent number: 6777817Abstract: Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: GrantFiled: September 5, 2003Date of Patent: August 17, 2004Assignee: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Patent number: 6617698Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: GrantFiled: March 9, 2001Date of Patent: September 9, 2003Assignee: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Publication number: 20020171132Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.Type: ApplicationFiled: March 9, 2001Publication date: November 21, 2002Applicant: International Business Machines CorporationInventors: Stephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran