Patents by Inventor Stephen C. Antaya
Stephen C. Antaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240125453Abstract: A receptacle connector assembly is presented herein. The receptacle connector assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
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Patent number: 11898718Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.Type: GrantFiled: December 21, 2021Date of Patent: February 13, 2024Assignee: ANTAYA TECHNOLOGIES CORPORATIONInventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
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Patent number: 11738412Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.Type: GrantFiled: June 8, 2022Date of Patent: August 29, 2023Assignee: APTIV TECHNOLOGIES LIMITEDInventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
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Publication number: 20230240015Abstract: A sensor device includes an emitter configured to emit radiation a detector configured to detect radiation reflected from an object and a cover having an interior surface facing the emitter or detector and allowing the radiation to pass through the cover. The sensor device also includes a heater with a wire-like trace directly deposited on the interior surface of the cover formed of a fluid comprising an electrically conductive material that was deposited onto a portion of the cover and cured. The heater has an electrically conductive connector pad formed with the heater by directly depositing and curing the fluid comprising the electrically conductive material directly on the interior surface of the cover simultaneously with forming the heater. The heater is positioned and arranged to sufficiently heat the cover while not blocking an area through which radiation must pass for proper operation of the emitter and the detector.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Inventors: Stephen C. Antaya, M. Jarod Scherer, Claudia Schulz, Michael E. Wheaton
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Publication number: 20220324064Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.Type: ApplicationFiled: June 8, 2022Publication date: October 13, 2022Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
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Patent number: 11383330Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.Type: GrantFiled: September 21, 2020Date of Patent: July 12, 2022Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
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Publication number: 20220112999Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.Type: ApplicationFiled: December 21, 2021Publication date: April 14, 2022Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
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Publication number: 20220088720Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.Type: ApplicationFiled: September 21, 2020Publication date: March 24, 2022Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
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Patent number: 11236884Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and an attachment portion configured to attach the receptacle terminal to a wire, a terminal housing defining a first oval-shaped opening and an oval-shaped cavity in which the connection portion of the receptacle terminal is disposed, and a terminal housing cover defining a second oval-shaped opening attached to the terminal housing, thereby enclosing the connection portion. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis that is perpendicular to the longitudinal axis.Type: GrantFiled: September 5, 2019Date of Patent: February 1, 2022Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
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Publication number: 20210071841Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and an attachment portion configured to attach the receptacle terminal to a wire, a terminal housing defining a first oval-shaped opening and an oval-shaped cavity in which the connection portion of the receptacle terminal is disposed, and a terminal housing cover defining a second oval-shaped opening attached to the terminal housing, thereby enclosing the connection portion. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis that is perpendicular to the longitudinal axis.Type: ApplicationFiled: September 5, 2019Publication date: March 11, 2021Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
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Publication number: 20200295475Abstract: An illustrative example method of making an electrically conductive connector comprising a first material and a second material, includes situating a layer comprising the second material at least partially within at least one layer comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.Type: ApplicationFiled: April 29, 2020Publication date: September 17, 2020Inventor: Stephen C. Antaya
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Patent number: 10773324Abstract: A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.Type: GrantFiled: October 3, 2017Date of Patent: September 15, 2020Assignee: Antaya Technologies CorporationInventor: Stephen C. Antaya
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Patent number: 10680354Abstract: An illustrative example method of making an electrically conductive connector comprising a first material and a second material, includes situating a layer comprising the second material at least partially within at least one layer comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.Type: GrantFiled: March 14, 2019Date of Patent: June 9, 2020Assignee: Antaya Technologies CorporationInventor: Stephen C. Antaya
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Publication number: 20200100367Abstract: An illustrative example method of making a sensor device including a cover covering at least one of an emitter and a detector includes establishing a heater on the cover by depositing a fluid comprising an electrically conductive material onto a portion of the cover and curing the deposited electrically conductive material.Type: ApplicationFiled: September 25, 2018Publication date: March 26, 2020Inventors: Stephen C. Antaya, M. Jarod Scherer, Claudia Schulz, Michael E. Wheaton
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Patent number: 9981347Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.Type: GrantFiled: May 12, 2016Date of Patent: May 29, 2018Assignee: Antaya Technologies CorporationInventors: John Pereira, Stephen C. Antaya
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Publication number: 20180099343Abstract: A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.Type: ApplicationFiled: October 3, 2017Publication date: April 12, 2018Inventor: Stephen C. Antaya
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Publication number: 20170368642Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.Type: ApplicationFiled: May 12, 2016Publication date: December 28, 2017Inventors: John Pereira, Stephen C. Antaya
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Patent number: 9368651Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.Type: GrantFiled: March 17, 2015Date of Patent: June 14, 2016Assignee: Antaya Technologies CorporationInventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer
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Publication number: 20150200310Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.Type: ApplicationFiled: March 17, 2015Publication date: July 16, 2015Inventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer
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Patent number: 9012776Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.Type: GrantFiled: June 3, 2014Date of Patent: April 21, 2015Assignee: Antaya Technologies CorporationInventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer