Patents by Inventor Stephen C. Antaya

Stephen C. Antaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125453
    Abstract: A receptacle connector assembly is presented herein. The receptacle connector assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
  • Patent number: 11898718
    Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: February 13, 2024
    Assignee: ANTAYA TECHNOLOGIES CORPORATION
    Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
  • Patent number: 11738412
    Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: August 29, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
  • Publication number: 20230240015
    Abstract: A sensor device includes an emitter configured to emit radiation a detector configured to detect radiation reflected from an object and a cover having an interior surface facing the emitter or detector and allowing the radiation to pass through the cover. The sensor device also includes a heater with a wire-like trace directly deposited on the interior surface of the cover formed of a fluid comprising an electrically conductive material that was deposited onto a portion of the cover and cured. The heater has an electrically conductive connector pad formed with the heater by directly depositing and curing the fluid comprising the electrically conductive material directly on the interior surface of the cover simultaneously with forming the heater. The heater is positioned and arranged to sufficiently heat the cover while not blocking an area through which radiation must pass for proper operation of the emitter and the detector.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Inventors: Stephen C. Antaya, M. Jarod Scherer, Claudia Schulz, Michael E. Wheaton
  • Publication number: 20220324064
    Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
    Type: Application
    Filed: June 8, 2022
    Publication date: October 13, 2022
    Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
  • Patent number: 11383330
    Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: July 12, 2022
    Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
  • Publication number: 20220112999
    Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 14, 2022
    Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
  • Publication number: 20220088720
    Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Inventors: Stephen C. Antaya, William Falk, Justin Amalfitano, Amit Datta
  • Patent number: 11236884
    Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and an attachment portion configured to attach the receptacle terminal to a wire, a terminal housing defining a first oval-shaped opening and an oval-shaped cavity in which the connection portion of the receptacle terminal is disposed, and a terminal housing cover defining a second oval-shaped opening attached to the terminal housing, thereby enclosing the connection portion. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis that is perpendicular to the longitudinal axis.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: February 1, 2022
    Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
  • Publication number: 20210071841
    Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and an attachment portion configured to attach the receptacle terminal to a wire, a terminal housing defining a first oval-shaped opening and an oval-shaped cavity in which the connection portion of the receptacle terminal is disposed, and a terminal housing cover defining a second oval-shaped opening attached to the terminal housing, thereby enclosing the connection portion. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis that is perpendicular to the longitudinal axis.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 11, 2021
    Inventors: Tyler Folger, Stefanie Merry, M. Jarod Scherer, Stephen C. Antaya
  • Publication number: 20200295475
    Abstract: An illustrative example method of making an electrically conductive connector comprising a first material and a second material, includes situating a layer comprising the second material at least partially within at least one layer comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.
    Type: Application
    Filed: April 29, 2020
    Publication date: September 17, 2020
    Inventor: Stephen C. Antaya
  • Patent number: 10773324
    Abstract: A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: September 15, 2020
    Assignee: Antaya Technologies Corporation
    Inventor: Stephen C. Antaya
  • Patent number: 10680354
    Abstract: An illustrative example method of making an electrically conductive connector comprising a first material and a second material, includes situating a layer comprising the second material at least partially within at least one layer comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: June 9, 2020
    Assignee: Antaya Technologies Corporation
    Inventor: Stephen C. Antaya
  • Publication number: 20200100367
    Abstract: An illustrative example method of making a sensor device including a cover covering at least one of an emitter and a detector includes establishing a heater on the cover by depositing a fluid comprising an electrically conductive material onto a portion of the cover and curing the deposited electrically conductive material.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Stephen C. Antaya, M. Jarod Scherer, Claudia Schulz, Michael E. Wheaton
  • Patent number: 9981347
    Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: May 29, 2018
    Assignee: Antaya Technologies Corporation
    Inventors: John Pereira, Stephen C. Antaya
  • Publication number: 20180099343
    Abstract: A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 12, 2018
    Inventor: Stephen C. Antaya
  • Publication number: 20170368642
    Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.
    Type: Application
    Filed: May 12, 2016
    Publication date: December 28, 2017
    Inventors: John Pereira, Stephen C. Antaya
  • Patent number: 9368651
    Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: June 14, 2016
    Assignee: Antaya Technologies Corporation
    Inventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer
  • Publication number: 20150200310
    Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.
    Type: Application
    Filed: March 17, 2015
    Publication date: July 16, 2015
    Inventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer
  • Patent number: 9012776
    Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 21, 2015
    Assignee: Antaya Technologies Corporation
    Inventors: Stephen C. Antaya, Manuel H. Machado, Matthew Jarod Scherer