Abstract: A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprises a) from about 10-90% by weight, relative to a) plus b), of carboxylic acid-functional acrylic resin(s); b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s); c) a catalyst in an amount sufficient to cure the composition at a temperature of about 300° F. or below for about 30 minutes or less; and d) optionally, a flexiblizing agent.

Abstract: The invention is directed to new thermosetting powder coating compositions comprising acid functional acrylic resin(s); polyepoxy resin(s) and catalyst(s). The powder coating compositions can be applied to substrates, especially heat sensitive substrates such as wood substrates and cured at low temperature and/or shorter time to provide finishes having controllable gloss and/or high hardness. The invention is also directed to an article comprising a heat sensitive substrate, such as wood substrate, and coated and cured on at least one surface of the substrate the powder coating composition of the invention.

Abstract: A thermosetting weatherable powder coating composition applyable to a temperature sensitive substrate by means of electrostatic spray or fluidized bed, and curable at low temperature to form a textured surface to hide irregularities on the surface of the underlying substrate. The powder coating composition includes a hardener with a functionality of 2 or greater capable of reacting with an acid or anhydride functional group, a polymeric coreactant with a functionality of 2 or greater capable of reacting with the hardener, a carboxylic acid functional polyester and optionally, a catalyst, but no texturing agent. The polymeric coreactant is made by polymerizing an ethylenically unsaturated monomer and at least one carboxyl acid functional ethylenically unsaturated monomer or anhydride functional ethylenically unsaturated monomer, and mixtures thereof.

Abstract: A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprises a) from about 10-90% by weight, relative to a) plus b), of carboxylic acid functional acrylic resin(s); b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s); c) a first catalyst functioning as an epoxy homopolymerization catalyst; and d) a second catalyst functioning as an epoxy/carboxylic acid reaction catalyst.

Abstract: The invention is directed to new thermosetting powder coating compositions comprising acid functional acrylic resin(s); polyepoxy resin(s) and catalyst(s). The powder coating compositions can be applied to substrates, especially heat sensitive substrates such as wood substrates and cured at low temperature and/or shorter time to provide finishes having controllable gloss and/or high hardness. The invention is also directed to an article comprising a heat sensitive substrate, such as wood substrate, and coated and cured on at least one surface of the substrate the powder coating composition of the invention.

Abstract: The invention is directed to a powder coating composition comprising a first component (A) and a second component (B) that is dry-blended or melt blended with the first component (A). The first component (A) comprises at least one polyepoxy resin and at least one catalyst. The second component (B) comprises at least one carboxylic acid functional acrylic resin. The polyepoxy resins include non-crystalline polyepoxy resins, crystalline polyepoxy resins, and mixtures thereof. The powder coating compositions can be applied to heat sensitive substrates and cured at lower temperature or for shorter time to provide finishes having controllable gloss and/or high hardness.

Abstract: The present invention discloses a method for the preparation of heat-resistant protective coatings wherein powder-based compositions are cured at temperatures greater than about 205.degree. C. to form high-film-build coatings which are substantially free of coating defects.

Abstract: The present invention is a powder coating composition as well as a process for its preparation. The powder coating, having a particle size of about 5 to 250 microns, can form improved, glossy coatings similar to chrome plate. The process comprises milling together a resinous binder and aluminum particles to produce a powder material, adding an effective amount of a fluidizing agent per hundred parts of binder to the powder material having a particle size of 5 to 250 microns.

Abstract: Thermosetting powder coatings are provided which comprise a high epoxide equivalent weight epoxy resin or mixture of epoxy resins, a cure catalyst for the epoxy resin, an acrylic resin and a polyamide resin. These powder coatings are useful for forming corrosion resistant, essentially crack-free coatings on metal cable, especially cable which is subjected to post-tensioning.

Abstract: Thermosetting powder coatings are provided which comprise a high epoxide equivalent weight epoxy resin or mixture of epoxy resins, a cure catalyst for the epoxy resin, an acrylic resin and a polyamide resin. These powder coatings are useful for forming corrosion resistant, essentially crack-free coating on metal cable, especially cable which is subjected to post-tensioning.

Abstract: Thermosetting powder coatings are provided which comprise a high epoxide equivalent weight epoxy resin or mixture of epoxy resins, a cure catalyst for the epoxy resin, an acrylic resin and a polyamide resin. These powder coatings are useful for forming corrosion resistant, essentially crack-free coatings on metal cable, especially cable which is subjected to post-tensioning.

Abstract: Electrical conductors can be coated with a cured, thermosetting powder coating which, in its uncured state comprises a saturated, carboxyl group-containing polyester resin, an epoxy resin, an acrylic resin and, optionally, a cure catalyst, benzoin and/or a polyamide resin to provide insulative coatings with reduced air entrapment and improved dielectric strength.