Patents by Inventor Stephen C. Jew

Stephen C. Jew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6254459
    Abstract: A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: July 3, 2001
    Assignee: Lam Research Corporation
    Inventors: Rajeev Bajaj, Herbert E. Litvak, Rahul K. Surana, Stephen C. Jew, Jiri Pecen
  • Patent number: 6068539
    Abstract: A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: May 30, 2000
    Assignee: Lam Research Corporation
    Inventors: Rajeev Bajaj, Herbert E. Litvak, Rahul K. Surana, Stephen C. Jew, Jiri Pecen