Abstract: A method of cleaning a reverse osmosis or nanofiltration membrane includes supplying pulses of bubbles to the membrane. A venturi device for supplying bubbles to improve the cleaning of reverse osmosis or nanofiltration membranes includes a venturi having a liquid inlet and an air inlet provided at a choke point of the venturi, as well as an outlet. The air inlet is provided with a plurality of tubes. A reverse osmosis plant includes a membrane pressure vessel having a fluid inlet, a permeate outlet, a concentrate outlet and an in place cleaning tank connected in line with the fluid inlet. A venturi valve is connected in-line between the cleaning tank and the fluid inlet.

Abstract: Methods, apparatuses and systems are disclosed for supplying gas from a multi-container Bulk Specialty Gases Supply System wherein at least one process parameter is automatically monitored to prevent over-filling of at least a first and second container without operator intervention.

Abstract: Methods, apparatuses and systems are disclosed for supplying gas from a multi-container BSGS system wherein at least one process parameter is automatically monitored to prevent over-filling of at least a first and second container without operator intervention.

Abstract: This invention relates to an integrated vapor or liquid phase reagent dispensing apparatus having a plurality of vessels and a plurality of carrier or inert gas feed/vapor or liquid phase reagent delivery manifolds, that may be used for continuously dispensing vapor or liquid phase reagents such as precursors for deposition of materials in the manufacture of semiconductor materials and devices.

Abstract: This invention relates to an integrated vapor or liquid phase reagent dispensing apparatus having a plurality of vessels and a plurality of carrier or inert gas feed/vapor or liquid phase reagent delivery manifolds, that may be used for continuously dispensing vapor or liquid phase reagents such as precursors for deposition of materials in the manufacture of semiconductor materials and devices.

Abstract: This invention relates to an integrated vapor or liquid phase reagent dispensing apparatus having a plurality of vessels and a plurality of carrier or inert gas feed/vapor or liquid phase reagent delivery manifolds, that may be used for continuously dispensing vapor or liquid phase reagents such as precursors for deposition of materials in the manufacture of semiconductor materials and devices.

Abstract: This invention relates to an integrated vapor or liquid phase reagent dispensing apparatus having a plurality of vessels and a plurality of carrier or inert gas feed/vapor or liquid phase reagent delivery manifolds, that may be used for continuously dispensing vapor or liquid phase reagents such as precursors for deposition of materials in the manufacture of semiconductor materials and devices.

Abstract: Provided are apparatuses and methods for mixing gases. The apparatuses are suitable for use in the manufacture of an electronic device. The apparatuses include a gas mixing manifold. A first, bulk gas source is connected to introduce a flow of a first gas to the manifold. A second gas source is connected to introduce a flow of a second gas to the manifold. The first and second gases are mixed in the manifold, thereby forming a gas mixture. A conduit is connected to one or more point of use for introducing a flow of the gas mixture thereto. The present invention is particularly applicable in the semiconductor manufacturing industry.

Abstract: Provided are apparatuses and methods for mixing gases. The apparatuses are suitable for use in the manufacture of an electronic device. The apparatuses include a gas mixing manifold. A first, bulk gas source is connected to introduce a flow of a first gas to the manifold. A second gas source is connected to introduce a flow of a second gas to the manifold. The first and second gases are mixed in the manifold, thereby forming a gas mixture. A conduit is connected to one or more point of use for introducing a flow of the gas mixture thereto. The present invention is particularly applicable in the semiconductor manufacturing industry.

Abstract: A method is described to remove condensible vapors in highly compressed gases without affecting the original particle spectra and concentrations. The vapors are separated from particles primarily through diffusion mechanism and collected on cold surfaces. Four important parameters are the length, the flow rate, the temperature, and the diffusion coefficients of the vapors to be removed. Important applications include sampling particles from high pressure gases and condensible vapor-free filling for ultra-pure cylinder gases.