Patents by Inventor Stephen Ching Wong

Stephen Ching Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having an interfacial adhesive layer
    Publication number: 20070080434
    Abstract: A semiconductor package has a substrate (8) and a semiconductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plurality of die contact pads (3) electrically connected by conducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).
    Type: Application
    Filed: September 13, 2006
    Publication date: April 12, 2007
    Inventors: Wen Seng Ho, Stephen Ching Wong