Abstract: An ultrasound imaging device or probe includes a tip having a heat conducting exterior housing within which an imaging element is positioned. The imaging element is engaged with a heat sink formed of an electrically insulating material that also has high thermal conductivity. The heat sink contacts and extends through and electrically insulating enclosure within which the imaging element is disposed. As a result, the heat generated by the imaging element can be readily conducted to the ambient environment via the heat sink and heat conductive exterior housing while also enabling the imaging element and other electrical components to be electrically insulated from the housing.

Abstract: An ultrasound imaging device or probe includes a tip having a heat conducting exterior housing within which an imaging element is positioned. The imaging element is engaged with a heat sink formed of an electrically insulating material that also has high thermal conductivity. The heat sink contacts and extends through and electrically insulating enclosure within which the imaging element is disposed. As a result, the heat generated by the imaging element can be readily conducted to the ambient environment via the heat sink and heat conductive exterior housing while also enabling the imaging element and other electrical components to be electrically insulated from the housing.

Abstract: A method and apparatus for connecting a plurality of coaxial cables to a printed circuit board in a compact connector. The apparatus is generally comprised of a flexible carrier, means for attaching the cable to the flexible carrier, a conductive base plate and a rigid beam providing pressure such that the electrical contact between the coaxial cable and the printed circuit board is maintained. The method generally comprises the steps of stripping the coaxial cables, bonding the coaxial cable to a flexible carrier, positioning the coaxial cables over traces of a printed circuit board providing pressure such that electrical contact is maintained between the cables and the printed circuit board.