Abstract: An improved heat sink for surface mounted power devices. According to one embodiment of the invention, the electrical contacts of a surface mounted power device are soldered to printed circuit board solder pads. The opposite, non-component, side of the printed circuit board is provided with thermal transfer pads, which are aligned in a parallel plane with the solder pads on the component side of the printed circuit board. The solder pads and thermal transfer pads are connected together by a number of plated through holes which provide a thermal conduction path. The thermal transfer pads are placed in proximity to a heat sink such that a high thermal conductivity exists between the surface mounted power device and the heat sink, allowing heat generated by the surface mounted power device to be conducted to the heat sink and dissipated. A thermal interface material may be used to improve thermal conductivity between the thermal transfer pads and the heat sink.