Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: A method of assembling an Application Specific Integrated Circuit (ASIC) assembly with attach hardware includes selecting a thickness of a load washer based on a target load to be applied by said attach hardware.

Abstract: A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.

Abstract: A connection assembly permits a make first and break last connection for primary power. The assembly includes a first pair of connectors, a second pair of connectors, and a compliance element associated with one of the first pair of connectors. The compliance element enables the first pair of connectors to mate prior to the mating of the second pair of connectors and to enable the first pair of connectors to disengage after the disengagement of the second pair of connectors.

Abstract: A method of assembling an Application Specific Integrated Circuit (ASIC) assembly with attach hardware includes adjusting or selecting a thickness of a load washer based on a target load to be applied by said attach hardware.

Abstract: A method of making a load plate for an attach hardware assembly of a circuit assembly includes adjusting a curvature of the load plate based on a target load to be applied by the attach hardware.

Abstract: A component of an attach hardware assembly is configured for use in securing an Application Specific Integrated Circuit (ASIC) to a circuit board as part of the attach hardware assembly and has a protective coating to protect that component from corrosion.

Abstract: An assembly is provided having a first circuit board and a second circuit board, each circuit board having a plurality of electrical connection points, electrical connection points on the first circuit board being connected to specified electrical connection points on the second circuit board by solder structures, the first and second circuit boards being stacked with respect to each other and with a defined standoff distance there between, the assembly comprising one or more stops having an inserted portion placed between the first and second circuit board along the perimeter of at least one of the electrical circuit boards, the inserted portion of each of the stops having a fixed, predetermined height.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.

Abstract: The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.