Abstract: A method of etching a silicon substrate is described. The method includes bonding a first silicon substrate to a sacrificial silicon substrate. The first silicon substrate is etched. A pressure is applied at an interface of the first silicon substrate and the sacrificial silicon substrate to cause the first silicon substrate to separate from the sacrificial silicon substrate. An apparatus having metal blades can be used to separate the substrates.

Abstract: A cluster tool is described including a main chamber, a load chamber, a fluid deposition chamber and an environmental controller. The load chamber is coupled to the main chamber and configured to receive one or more substrates. The fluid deposition chamber is coupled to the main chamber and includes a fluid deposition device configured to deposit fluid onto the one or more substrates. A robot is included in the main chamber, the robot configured to transfer the one or more substrates between the load chamber and the fluid deposition chamber. The environmental controller is configured to maintain a substantially autonomous environment within the cluster tool.

Abstract: A fluid deposition device including a platen and a cartridge mount assembly is described. The platen is configured to support a substrate upon which a fluid will be deposited. The cartridge mount assembly includes a receptacle configured to receive a print cartridge and multiple electrical contacts configured to mate with corresponding electrical contacts on the print cartridge. In one implementation, the cartridge mount assembly further includes a vacuum connector configured to mate with a vacuum inlet included on the print cartridge. When the print cartridge is received in the receptacle, the print cartridge can form connections with the electrical contacts and with the vacuum connector of the receptacle at substantially the same timee.

Abstract: A method for forming at least one opening in a receptacle comprises the steps of providing a receptacle having a cover with an exterior surface and an interior surface covering a cavity. A cutting mechanism is also provided having at least one blade. The cover is pierced with the blade, and the blade is moved through the cover to cut a portion of the cover and create an opening in the cover to provide access into the cavity. Further, the cut portion curls on top of the exterior surface as the opening is created.