Abstract: Disclosed are embodiments of a universal electroplating rack and method of using the rack. The universal electroplating rack comprises a main body adapted to accommodate and electrically connect to one or more customized inserts. Each customized insert is adapted to accommodate and electrically connect to a single workpiece. Additionally, both the main body and the customized insert(s) can comprise thief plates configured to improve plating uniformity across the plating surface area of the workpiece(s). Such a universal plating rack ensures a constant plating surface area regardless of workpiece size by varying the dimensions of the customized insert(s) so that universal processing parameters can be used for all workpieces. Consequently, for each new product developed, the universal electroplating racks of the invention will effectively reduce introduction costs, will avoid the need to qualify new electroplating process parameters (e.g., cycle time), and will effectively reduce lead time required.