Patents by Inventor Stephen E Babinetz

Stephen E Babinetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
    Publication number: 20100186991
    Abstract: A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire.
    Type: Application
    Filed: October 18, 2006
    Publication date: July 29, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Kazunori Tajima, Wei Qin, Stephen E. Babinetz
  • Method and apparatus for forming a low profile wire loop
    Patent number: 7464854
    Abstract: A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a looped portion in the wire adjacent the first wire bond. The method also includes lowering the wire bonding tool in a direction towards the first wire bond after the forming step. The lowering step is interrupted prior to the wire bonding tool contacting the first wire bond. The method also includes bonding a second end of the wire to a second bonding location.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: December 16, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Stephen E Babinetz