Abstract: A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a “package-first, release-second” sequence for fabricating MEMS devices.

Abstract: A turbine in which a turbine wheel is mounted in a housing between an inlet and an outlet. Rotatably mounted vanes are located in the inlet and coupled by linkages to an actuator which is displaceable relative to the vanes so as to control the angular orientation of the vanes relative to the housing inlet. Each vane is coupled to the actuator by a flexible link, the ends of the link being secured to the vanes and actuator in a manner which prevents relative movement between the link ends and the vane or the actuator. Flexing of the links thus accommodates the rotation of the vanes which results from actuator displacements.

Abstract: A method of making an electrical interconnection from a microelectronic device to a package, comprising ball or wedge compression bonding a gold-based conductor directly to a silicon surface, such as a polysilicon bonding pad in a MEMS or IMEMS device, without using layers of aluminum or titanium disposed in-between the conductor and the silicon surface. After compression bonding, optional heating of the bond above 363 C. allows formation of a liquid gold-silicon eutectic phase containing approximately 3% (by weight) silicon, which significantly improves the bond strength by reforming and enhancing the initial compression bond. The same process can be used for improving the bond strength of Au—Ge bonds by forming a liquid Au-12Ge eutectic phase.

Abstract: A turbine in which a turbine wheel is mounted in a housing between an inlet and an outlet. Rotatably mounted vanes are located in the inlet and coupled by linkages to an actuator which is displaceable relative to the vanes so as to control the angular orientation of the vanes relative to the housing inlet. Each vane is coupled to the actuator by a flexible link, the ends of the link being secured to the vanes and actuator in a manner which prevents relative movement between the link ends and the vane or the actuator. Flexing of the links thus accommodates the rotation of the vanes which results from actuator displacements.

Abstract: Methods for "monolithic module assembly" which translate many of the advantages of monolithic module construction of thin-film PV modules to wafered c-Si PV modules. Methods employ using back-contact solar cells positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The methods of the invention allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

Abstract: Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

Abstract: A variable geometry turbine comprising a housing 1 including an annular cavity 19 which supports a moveable annular wall member 5. An annular turbine inlet passageway 4 is defined between an end face of the moveable wall member 5 and a facing wall 6 of the housing 1. The moveable wall member 5 is moveable so as to vary the width of the annular turbine inlet passageway 4. Gas tight seals 20, 21 are provided between the wall member 5 and radially inner and outer surfaces of the cavity 19 and apertures 24 are provided through the face of the annular wall member 5. The arrangement is such that the mean pressure difference between the cavity 19 and the annular turbine inlet passageway 4 is reduced so that the total axial load on the wall member 5 due to gas flow through the inlet passageway 4 is reduced.