Patents by Inventor Stephen E. Gons

Stephen E. Gons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding gold or gold alloy wire to lead tin solder
    Patent number: 4907734
    Abstract: A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
    Type: Grant
    Filed: October 28, 1988
    Date of Patent: March 13, 1990
    Assignee: International Business Machines Corporation
    Inventors: H. Ward Conru, Stephen E. Gons, Gordon C. Osborne, Jr., Douglas W. Phelps, Jr., Stephen G. Starr, William C. Ward