Abstract: Insulating ceramic panels and methods of forming insulating ceramic panels are disclosed herein. The insulating ceramic panels include a plurality of hollow particles and an oxide binder. The plurality of hollow particles are formed from a hollow particle material that includes a metal oxide. The plurality of hollow particles defines an average equivalent particle diameter of at least 10 micrometers (?m) and at most 500 ?m. In addition, the plurality of hollow particles defines an average wall thickness that is at least 3% and at most 30% of the average equivalent particle diameter. The oxide binder material attaches each hollow particle to at least one other hollow particle and differs from the hollow particle material. The insulating ceramic panels define a particle-enclosed void volume fraction, which is enclosed within the plurality of hollow particles, and an interstitial void volume fraction, which is defined within an interstitial space among the plurality of hollow particles.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material includes a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further includes a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material includes a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further includes a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material comprises a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further comprises a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise. The overall mixture can be extruded through a nozzle to manufacture the low-density, high porosity ceramic part. The precursor material is produced by obtaining a refractory fiber slurry, and adding a viscosity control additive to the slurry to provide the slurry with a viscosity that is suitable for extrusion through a nozzle to manufacture a low-density, high-porosity ceramic part.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material comprises a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further comprises a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise. The overall mixture can be extruded through a nozzle to manufacture the low-density, high porosity ceramic part. The precursor material is produced by obtaining a refractory fiber slurry, and adding a viscosity control additive to the slurry to provide the slurry with a viscosity that is suitable for extrusion through a nozzle to manufacture a low-density, high-porosity ceramic part.

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract: A high temperature structural insulation layer is disclosed. A micro-truss structure comprises a porous lattice structure, and a protected substructure comprises at least one hole. At least one fiber non-adhesively couples the micro-truss structure to the protected substructure via the at least one fiber passing through one or more spaces within the porous lattice structure.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: Smart curing by coupling a catalyst to one or more surface(s) of one or more microelectronic element(s) is generally described. In this regard, according to one example embodiment, a catalyst is coupled to one or more surface(s) of one or more microelectronic element(s) to promote polymerization of an adhesive brought in contact with the catalyst.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed.