Abstract: Insulating ceramic panels and methods of forming insulating ceramic panels. The insulating ceramic panels include a plurality of hollow particles and an oxide binder. The plurality of hollow particles are formed from a hollow particle material that includes a metal oxide. The plurality of hollow particles defines an average equivalent particle diameter of at least 10 micrometers (µm) and at most 500 µm. In addition, the plurality of hollow particles defines an average wall thickness that is at least 3% and at most 30% of the average equivalent particle diameter. The oxide binder material attaches each hollow particle to at least one other hollow particle and differs from the hollow particle material. The insulating ceramic panels define a particle-enclosed void volume fraction, which is enclosed within the plurality of hollow particles, and an interstitial void volume fraction, which is defined within an interstitial space among the plurality of hollow particles.

Abstract: Insulating ceramic panels and methods of forming insulating ceramic panels are disclosed herein. The insulating ceramic panels include a plurality of hollow particles and an oxide binder. The plurality of hollow particles are formed from a hollow particle material that includes a metal oxide. The plurality of hollow particles defines an average equivalent particle diameter of at least 10 micrometers (?m) and at most 500 ?m. In addition, the plurality of hollow particles defines an average wall thickness that is at least 3% and at most 30% of the average equivalent particle diameter. The oxide binder material attaches each hollow particle to at least one other hollow particle and differs from the hollow particle material. The insulating ceramic panels define a particle-enclosed void volume fraction, which is enclosed within the plurality of hollow particles, and an interstitial void volume fraction, which is defined within an interstitial space among the plurality of hollow particles.

Abstract: Insulating ceramic panels and methods of forming insulating ceramic panels are disclosed herein. The insulating ceramic panels include a plurality of hollow particles and an oxide binder. The plurality of hollow particles are formed from a hollow particle material that includes a metal oxide. The plurality of hollow particles defines an average equivalent particle diameter of at least 10 micrometers (?m) and at most 500 ?m. In addition, the plurality of hollow particles defines an average wall thickness that is at least 3% and at most 30% of the average equivalent particle diameter. The oxide binder material attaches each hollow particle to at least one other hollow particle and differs from the hollow particle material. The insulating ceramic panels define a particle-enclosed void volume fraction, which is enclosed within the plurality of hollow particles, and an interstitial void volume fraction, which is defined within an interstitial space among the plurality of hollow particles.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material includes a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further includes a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material includes a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further includes a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise.

Abstract: A mechanically attached thermal protection system (MATPS) includes an insulating tile having a top surface, a bottom surface, and a plurality of access holes that extend through the insulating tile from the top surface to the bottom surface. A plurality of brackets include a first end attached to the insulating tile and a second end including a mounting hole therethrough, the second end being positioned proximate the bottom surface of the insulating tile. A plurality of fasteners are positioned proximate the bottom surface of the insulating tile and at least partially positioned within one of the access holes so as to be accessible from the top surface of the insulating tile through one of the plurality of access holes. A MATPS including a plurality of air channels within the insulating tile and a method for sealing these air channels to those within an adjacent structure is also described herein.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material comprises a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further comprises a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise. The overall mixture can be extruded through a nozzle to manufacture the low-density, high porosity ceramic part. The precursor material is produced by obtaining a refractory fiber slurry, and adding a viscosity control additive to the slurry to provide the slurry with a viscosity that is suitable for extrusion through a nozzle to manufacture a low-density, high-porosity ceramic part.

Abstract: A precursor material is provided for additive manufacturing of a low-density, high-porosity ceramic part. The precursor material comprises a body of refractory fibers and a binder in admixture with the body of refractory fibers. The precursor material further comprises a viscosity control additive in admixture with the binder and the body of refractory fibers to provide an overall mixture with a viscosity between about 0.3 centipoise and about 150,000 centipoise. The overall mixture can be extruded through a nozzle to manufacture the low-density, high porosity ceramic part. The precursor material is produced by obtaining a refractory fiber slurry, and adding a viscosity control additive to the slurry to provide the slurry with a viscosity that is suitable for extrusion through a nozzle to manufacture a low-density, high-porosity ceramic part.

Abstract: A high temperature structural insulation layer is disclosed. A micro-truss structure comprises a porous lattice structure, and a protected substructure comprises at least one hole. At least one fiber non-adhesively couples the micro-truss structure to the protected substructure via the at least one fiber passing through one or more spaces within the porous lattice structure.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: A composition, a method, and a system for a solder flux are disclosed herein. In various embodiments, a solder flux composition may comprise a surfactant and less than about 20% of a carboxylic acid. In some of these embodiments, the solder flux composition may be used in lead-free soldering processes.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: An in-situ method for performing organic metathesis polymer chemistry in the solid state includes the step of providing an organic monomer and a catalyst, the catalyst for driving a metathesis polymerization reaction of the monomer. The organic monomer can be provided as a liquid monomer. The reaction produces reaction products including a polymeric end product and at least one volatile reaction product. At least a portion of the volatile reaction product is removed during the reaction to favor formation of the reaction product. Significantly, the reaction is performed at a temperature being below an average melting point of the polymeric end product such that at least a portion of the reaction is performed in the solid phase.