Abstract: An expansion card bracket for a computer server has an expansion card support attachable to a motherboard and an expansion card accepting portion disposed near a top of the support. The expansion card accepting portion is configured to support an expansion card at an acute angle of inclination with respect to the motherboard. The acute angle of inclination is substantially equal to an angle of inclination of a connector for receiving the expansion card.

Abstract: A cabinet system includes first and second cabinets each including first and second side walls, upper and lower rectilinear frames extending between the side walls at vertically spaced-apart locations therealong and weldments connecting the upper and lower frames to the side walls to form a rigid housing. A pair of spaced-apart locating holes are formed in the side wall of the first cabinet adjacent to the lower frame thereof and an additional locating hole is present in the first wall of the first cabinet adjacent to the upper frame thereof. Further, a pair of spaced-part locating pins are provided in the second side wall of the second cabinet adjacent to the lower frame thereof along with an additional locating pin in the side wall of the second cabinet adjacent to the upper frame thereof.

Abstract: A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

Abstract: An apparatus is disclosed for fluid dynamically augmenting a heat sink to displace a boundary layer in the cooling fluid adjacent to the surfaces of the heat sink cooling fins. Ribs with a thickness slightly less than the thickness of the boundary layer cause secondary flow in the cooling fluid downstream from the rib in the form of vortices which displace hotter slower moving fluid by drawing in cooler fluid farther from the surface of the fins. The ribs are constructed on the surface of the cooling fins in an inverted V-shaped configuration. The angle of the ribs in the inverted V-shaped configuration is optimized to intersect the entire flow of the fluid through the heat sink forming a means for efficient dissipating heat from the heat sink over its entire surface area.