Abstract: One aspect of the present disclosure relates to an embolic filter device configured for placement in a blood vessel to capture emboli during a medical procedure. The embolic filter device can include an expandable frame member and a membrane. The expandable frame member can include a radial support member operably connected to first and second longitudinal struts, and an engaging portion extending between the first and second longitudinal struts. The engaging portion can be shaped and configured to temporarily receive, and sealingly mate with, a portion of an endovascular catheter during the medical procedure. The membrane can be securely connected to the frame member and define a collection chamber for captured emboli. The membrane can be configured to cover substantially all of the cross-sectional area of the blood vessel when the embolic filter device is deployed in the blood vessel.

Abstract: Various exemplary embodiments relate to a method and related network node including one or more of the following: receiving, at a session management node, a usage monitoring report from a usage monitoring node, the usage monitoring report including a reported usage amount for a first monitoring key; updating a current usage amount based upon the reported usage amount; identifying a current monitoring key; and requesting additional monitoring from the usage monitoring node for the current monitoring key. Various exemplary embodiments additionally relate to a method and related network node including one or more of the following: taking a policy action based on the current usage amount; determining a next threshold based on the current usage amount; determining a second usage amount associated with a second monitoring key; and adding the current usage amount to at least the second usage amount to determine a total usage amount.

Abstract: The invention is directed to providing a method and apparatus for managing and tracking default bearers in an Internet Protocol Connectivity Access Network (IP-CAN) session of a General Packet Radio Service (GPRS) network while observing the requirements of the GPRS specifications.

Abstract: The invention provides a structure for automotive vehicle manufactured by rotational molding process having enough stiffness, strength and durability to sustain the weight of passengers without requiring any supporting sub-frames. The multilayer structure along with foam layer is used to provide additional impact strength and reliability to the structure of the vehicle against accidents. The single step production of structurally complex shaped body parts for automotive vehicle enables economic manufacturing and assembly of the automotive vehicle.

Abstract: A wellhead seal assembly that forms a metal-to-metal seal between inner and outer wellhead members and a face seal between inner wellhead members. The face seal is created by two opposing sealing surfaces on inner wellhead members that sealingly engage each other. The inner wellhead members that interact to form a face seal may be a casing hanger, bridging hanger, or lockdown hanger. A wicker profile formed on one of the opposing seal surfaces bites into the opposing seal surface in response to a load. The face seal is designed such that well pressure enhances the face seal.

Abstract: A substrate defining a cavity comprising a wide, shallow first portion and a narrow, deep second portion is provided. The first portion of the cavity extends into the substrate from the front side of the substrate and is filled with sacrificial material. The second portion extends deeper into the substrate from the first portion. A device structure is fabricated over the sacrificial material. A release etchant is introduced from the back side of the substrate via the second portion of the cavity to remove from the first portion of the cavity the sacrificial material underlying the device structure. Removing from the first portion of the cavity the sacrificial material underlying the device structure by introducing the release etchant from the back side of the substrate via the second portion of the cavity allows the release etch to be performed without exposing the device structure to the release etchant.

Abstract: The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate, encapsulant covering the FBAR stack, and an acoustic Bragg reflector between the top surface of the FBAR stack and the encapsulant. The FBAR stack comprises an FBAR and has a top surface remote from the substrate. The FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes. The acoustic Bragg reflector comprises a metal Bragg layer and a plastic Bragg layer juxtaposed with the metal Bragg layer.

Abstract: The film bulk acoustic resonator (FBAR) device comprises a substrate, an acoustic Bragg reflector over the substrate, a piezoelectric element over the acoustic Bragg reflector, and a remote-side electrode over the piezoelectric element. The acoustic Bragg reflector comprises a metal Bragg layer juxtaposed with a plastic Bragg layer. The large ratio between the acoustic impedances of the plastic material of the plastic Bragg layer and the metal of the metal Bragg layer provides sufficient acoustic isolation between the FBAR and the substrate for the frequency response of the FBAR device to exhibit minor, if any, spurious artifacts arising from undesirable acoustic coupling between the FBAR and the substrate.

Abstract: The band-pass filter has first terminals, second terminals, a first decoupled stacked bulk acoustic resonator (DSBAR), a second DSBAR, and an electrical circuit connecting the first DSBAR and the second DSBAR in series between the first terminals and the second terminals. Each DSBAR has a first film bulk acoustic resonator (FBAR), a second FBAR and an acoustic decoupler between the FBARs. Each FBAR has opposed planar electrodes and a piezoelectric element between the electrodes.

Abstract: A substrate defining a cavity comprising a wide, shallow first portion and a narrow, deep second portion is provided. The first portion of the cavity extends into the substrate from the front side of the substrate and is filled with sacrificial material. The second portion extends deeper into the substrate from the first portion. A device structure is fabricated over the sacrificial material. A release etchant is introduced from the back side of the substrate via the second portion of the cavity to remove from the first portion of the cavity the sacrificial material underlying the device structure. Removing from the first portion of the cavity the sacrificial material underlying the device structure by introducing the release etchant from the back side of the substrate via the second portion of the cavity allows the release etch to be performed without exposing the device structure to the release etchant.

Abstract: The band-pass filter has first terminals, second terminals, a first decoupled stacked bulk acoustic resonator (DSBAR), a second DSBAR, and an electrical circuit connecting the first DSBAR and the second DSBAR in series between the first terminals and the second terminals. Each DSBAR has a first film bulk acoustic resonator (FBAR), a second FBAR and an acoustic decoupler between the FBARs. Each FBAR has opposed planar electrodes and a piezoelectric element between the electrodes.

Abstract: The film acoustically-coupled transformer (FACT) has decoupled stacked bulk acoustic resonators (DSBARs), a first electrical circuit and a second electrical circuit. Each of the DSBARs has a lower film bulk acoustic resonator (FBAR), an upper FBAR and an acoustic decoupler. The upper FBAR is stacked on the lower FBAR and the acoustic decoupler is located between the FBARs. Each FBAR has opposed planar electrodes and a piezoelectric element between the electrodes. The first electrical circuit interconnects the lower FBARs. The second electrical circuit interconnects the upper FBARs. The FBARs of one of the DSBARs differ in electrical impedance from the FBARs of another of the DSBARs. The FACT has an impedance transformation ratio greater than 1:m2, where m is the number of DSBARs. The actual impedance transformation ratio depends on the ratio of the impedances of the FBARs.

Abstract: A compressor diffuser for a vehicle engine turbocharger, the diffuser comprising: a diffuser housing having a gas flow path having a side wall connecting a gas inlet to a gas outlet; a plurality of pivotally mounted diffuser vanes arranged in the flow path to control gas flow, and a vane angle control device for adjusting the angle of each of the plurality of vanes in the flow path; the control device comprising a unison ring coupled to the plurality of vanes in such a way that rotation of the unison ring pivots each of the vanes by interaction of a cam surface with a respective cam follower.

Abstract: A compressor diffuser for a vehicle engine turbocharger, the diffuser comprising: a diffuser housing having a gas flow path having a side wall connecting a gas inlet to a gas outlet; a plurality of pivotally mounted diffuser vanes arranged in the flow path to control gas flow, and a vane angle control device for adjusting the angle of each of the plurality of vanes in the flow path; the control device comprising a unison ring coupled to the plurality of vanes in such a way that rotation of the unison ring pivots each of the vanes by interaction of a cam surface with a respective cam follower.

Abstract: The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate, encapsulant covering the FBAR stack, and an acoustic Bragg reflector between the top surface of the FBAR stack and the encapsulant. The FBAR stack comprises an FBAR and has a top surface remote from the substrate. The FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes. The acoustic Bragg reflector comprises a metal Bragg layer and a plastic Bragg layer juxtaposed with the metal Bragg layer.

Abstract: The film bulk acoustic resonator (FBAR) device comprises a substrate, an acoustic Bragg reflector over the substrate, a piezoelectric element over the acoustic Bragg reflector, and a remote-side electrode over the piezoelectric element. The acoustic Bragg reflector comprises a metal Bragg layer juxtaposed with a plastic Bragg layer. The large ratio between the acoustic impedances of the plastic material of the plastic Bragg layer and the metal of the metal Bragg layer provides sufficient acoustic isolation between the FBAR and the substrate for the frequency response of the FBAR device to exhibit minor, if any, spurious artifacts arising from undesirable acoustic coupling between the FBAR and the substrate.

Abstract: The film acoustically-coupled transformer (FACT) has a first and second decoupled stacked bulk acoustic resonators (DSBARs). Each DSBAR has a lower film bulk acoustic resonator (FBAR), an upper FBAR atop the lower FBAR, and an acoustic decoupler between them FBARs. Each FBAR has opposed planar electrodes and a piezoelectric element between the electrodes. A first electrical circuit interconnects the lowers FBAR of the first DSBAR and the second DSBAR. A second electrical circuit interconnects the upper FBARs of the first DSBAR and the second DSBAR. In at least one of the DSBARs, the acoustic decoupler and one electrode of the each of the lower FBAR and the upper FBAR adjacent the acoustic decoupler constitute a parasitic capacitor. The FACT additionally has an inductor electrically connected in parallel with the parasitic capacitor. The inductor increases the common-mode rejection ratio of the FACT.

Abstract: One embodiment of the film acoustically-coupled transformer (FACT) includes a decoupled stacked bulk acoustic resonator (DSBAR) having a lower film bulk acoustic resonator (FBAR) an upper FBAR stacked on the lower FBAR, and, between the FBARs, an acoustic decoupler comprising a layer of acoustic decoupling material. Each FBAR has opposed planar electrodes with a piezoelectric element between them. The FACT additionally has first terminals electrically connected to the electrodes of one FBAR and second terminals electrically connected to the electrodes of the other FBAR. Another embodiment has decoupled stacked bulk acoustic resonators (DSBARs), each as described above, a first electrical circuit interconnecting the lower FBARs, and a second electrical circuit interconnecting the upper FBARs. The FACT provides impedance transformation, can linking single-ended circuitry with balanced circuitry or vice versa and electrically isolates primary and secondary.

Abstract: The decoupled stacked bulk acoustic resonator (DSBAR) device has a lower film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of piezoelectric material between the electrodes. The acoustic decoupler has acoustic decoupling layers of acoustic decoupling materials having different acoustic impedances. The acoustic impedances and thicknesses of the acoustic decoupling layers determine the acoustic impedance of the acoustic decoupler, and, hence, the pass bandwidth of the DSBAR device. Process-compatible acoustic decoupling materials can then be used to make acoustic decouplers with acoustic impedances (and pass bandwidths) that are not otherwise obtainable due to the lack of process-compatible acoustic decoupling materials with such acoustic impedances.

Abstract: The band-pass filter has an upper film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and, between the FBARs, an acoustic decoupler comprising a layer of acoustic decoupling material. Each of the FBARs has opposed planar electrodes and a piezoelectric element between the electrodes. The acoustic decoupler controls the coupling of acoustic energy between the FBARs. Specifically, the acoustic decoupler couples less acoustic energy between the FBARs than would be coupled by direct contact between the FBARs. The reduced acoustic coupling gives the band-pass filter desirable in-band and out-of-band properties.