Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.

Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.

Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.

Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.

Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.

Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.

Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.

Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.

Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.

Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.

Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.

Abstract: A self-calibrating pressure sensor system may measure the pressure of a gas or liquid. The system may include a pressure sensor, a reference sensor, and a drift compensation system. The pressure sensor may include a pressure-sensing flexible diaphragm with one side exposed to the gas or liquid and another side forming a wall of a sealed chamber. The reference sensor may include a reference flexible diaphragm that has two sides that are both within or exposed to the same sealed chamber. The drift compensation system may produce information that is indicative of the pressure of the gas or liquid based on the signal from the pressure sensor, and compensate for drift in this signal based on changes in the signal from the reference sensor. The pressure-sensing flexible diaphragm and the reference flexible diaphragm may be made at substantially the same time by depositing or growing a single layer of material in a single continuous step.

Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.

Abstract: A method and apparatus for providing a sub-ground plane for a micromachined device. The sub-ground plane is formed in or on the substrate. Above the sub-ground plane is a dielectric and then a discontinuous conductive layer used for interconnects for parts of the micromachined device. A movable microstructure is suspended above the interconnect layer. A conductive layer can be suspended above the movable microstructure. In one embodiment, the sub-ground plane is diffused into the substrate or a well in the substrate, and is of an opposite type from the type of silicon into which it is diffused. Alternatively, the sub-ground plane is formed from a conductive layer, deposited over the substrate before the layer used for interconnects.

Abstract: A method and apparatus for providing a sub-ground plane for a micromachined device. The sub-ground plane is formed in or on the substrate. Above the sub-ground plane is a dielectric and then a discontinuous conductive layer used for interconnects for parts of the micromachined device. A movable microstructure is suspended above the interconnect layer. A conductive layer can be suspended above the movable microstructure. In one embodiment, the sub-ground plane is diffused into the substrate or a well in the substrate, and is of an opposite type from the type of silicon into which it is diffused. Alternatively, the sub-ground plane is formed from a conductive layer, deposited over the substrate before the layer used for interconnects.

Abstract: A ferroelectric motor comprises a single layer of ferroelectric material electrically excited by an array of electrical contacts and an electrical excitation source for supplying phased electrical signals to the contacts thereby creating a travelling wave of mechanical deformation in the ferroelectric layer and actuating an actuator. In alternative embodiments of the invention, the actuator may be linear or rotary. The motor may be fabricated on a single integrated circuit die, in which case the layer of ferroelectric material may be a thin film of PZT. In other embodiments a motor may comprise two dies which are sandwiched together by wafer to wafer bonding. Portions of a die may be removed to permit a linear actuator to project beyond the die.