Patents by Inventor Stephen F. Becka
Stephen F. Becka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240061012Abstract: An example transducer includes an upper magnetic circuit assembly including an upper excitation ring, a lower magnetic circuit assembly including a lower excitation ring, and a proof mass assembly positioned between the upper and lower magnetic circuit assemblies. A coefficient of thermal expansion (CTE) of the proof mass assembly is lower than a CTE of each of the upper and lower excitation rings. The transduces also includes an outer support structure coupled to an outer surface of each of the upper and lower excitation rings, and the outer support structure includes at least one cutout configured to reduce a circumferential stiffness of the outer support structure.Type: ApplicationFiled: August 16, 2022Publication date: February 22, 2024Inventors: Paul W. Dwyer, Stephen F. Becka
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Publication number: 20230366909Abstract: A proof mass assembly includes a monolithic substrate, the monolithic substrate including a proof mass, a proof mass support, and a flexure connecting the proof mass to the proof mass support. The proof mass is configured to rotate relative to the proof mass support via the flexure. The monolithic substrate further includes a first resonator connected to a first major surface of the proof mass and a first major surface of the proof mass support and a second resonator connected to a second major surface of the proof mass and a second major surface of the proof mass support.Type: ApplicationFiled: December 23, 2022Publication date: November 16, 2023Inventors: James Christopher Milne, Stephen F. Becka
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Patent number: 11521772Abstract: The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.Type: GrantFiled: February 11, 2020Date of Patent: December 6, 2022Assignee: Honeywell International Inc.Inventors: Paul W. Dwyer, Neha Kulkarni, Stephen F. Becka
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Publication number: 20210246557Abstract: The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.Type: ApplicationFiled: February 11, 2020Publication date: August 12, 2021Inventors: Paul W. Dwyer, Neha Kulkarni, Stephen F. Becka
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Patent number: 10823754Abstract: In some examples, a device comprises a proof mass and a support base configured to support the proof mass, wherein the proof mass is configured to displace in response to an acceleration of the device. The device also comprises a flexure configured to flexibly connect the proof mass to the support base. The device also comprises a strain-monitoring device configured to measure an amount of strain on the support base.Type: GrantFiled: November 14, 2014Date of Patent: November 3, 2020Assignee: Honeywell International Inc.Inventors: Paul W. Dwyer, Stephen F. Becka
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Patent number: 10401378Abstract: Accelerometers as disclosed herein include a proof mass assembly and an accelerometer support. In some examples, a combined height and a combined coefficient of thermal expansion (CTE) of the materials of the accelerometer support is configured to substantially match a CTE of material of the non-moving member with a height substantially similar to the combined height of the accelerometer support. In some examples, the accelerometer support is configured to connect to a center raised pad of the proof mass assembly and maintain a capacitance gap between a capacitance plate on a proof mass of the proof mass assembly and a portion of the non-moving member.Type: GrantFiled: October 21, 2015Date of Patent: September 3, 2019Assignee: Honeywell International Inc.Inventors: Paul W. Dwyer, Stephen F. Becka
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Patent number: 9689888Abstract: A device is described that includes a pendulous proof mass, a support base, a flexure, and at least two resonators. The support base defines a plane and supports the pendulous proof mass. The flexure flexibly connects the pendulous proof mass to the support base, suspends the pendulous proof mass within the support base, and in response to an acceleration of the device, the pendulous proof mass rotates about the flexure in the plane defined by the support base. The at least two resonators flexibly connect the pendulous proof mass to the support base and flex based on the rotation of the pendulous proof mass about the flexure, wherein each of the at least two resonators resonate at a respective resonant frequency.Type: GrantFiled: November 14, 2014Date of Patent: June 27, 2017Assignee: Honeywell International Inc.Inventor: Stephen F. Becka
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Publication number: 20170115321Abstract: Accelerometers as disclosed herein include a proof mass assembly and an accelerometer support. In some examples, a combined height and a combined coefficient of thermal expansion (CTE) of the materials of the accelerometer support is configured to substantially match a CTE of material of the non-moving member with a height substantially similar to the combined height of the accelerometer support. In some examples, the accelerometer support is configured to connect to a center raised pad of the proof mass assembly and maintain a capacitance gap between a capacitance plate on a proof mass of the proof mass assembly and a portion of the non-moving member.Type: ApplicationFiled: October 21, 2015Publication date: April 27, 2017Inventors: Paul W. Dwyer, Stephen F. Becka
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Publication number: 20160139171Abstract: A device is described that includes a pendulous proof mass, a support base, a flexure, and at least two resonators. The support base defines a plane and supports the pendulous proof mass. The flexure flexibly connects the pendulous proof mass to the support base, suspends the pendulous proof mass within the support base, and in response to an acceleration of the device, the pendulous proof mass rotates about the flexure in the plane defined by the support base. The at least two resonators flexibly connect the pendulous proof mass to the support base and flex based on the rotation of the pendulous proof mass about the flexure, wherein each of the at least two resonators resonate at a respective resonant frequency.Type: ApplicationFiled: November 14, 2014Publication date: May 19, 2016Inventor: Stephen F. Becka
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Publication number: 20160139170Abstract: In some examples, a device comprises a proof mass and a support base configured to support the proof mass, wherein the proof mass is configured to displace in response to an acceleration of the device. The device also comprises a flexure configured to flexibly connect the proof mass to the support base. The device also comprises a strain-monitoring device configured to measure an amount of strain on the support base.Type: ApplicationFiled: November 14, 2014Publication date: May 19, 2016Inventors: Paul W. Dwyer, Stephen F. Becka
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Patent number: 7392685Abstract: An apparatus and method for an accelerometer mechanism having a proof mass that is suspended for out-of-plane motion between first and second damping plates, wherein at least one of the first and second damping plates is movable between first and second positions relative to the proof mass under the control of a position control structure that is coupled to the movable damping plate for positioning the damping plate in the second position relative to the proof mass.Type: GrantFiled: July 26, 2005Date of Patent: July 1, 2008Assignee: Honeywell International Inc.Inventor: Stephen F. Becka
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Patent number: 7380454Abstract: Methods and systems for forming accelerometers include forming a load beam supported at one end having an input interdigital transducer (IDT) and an output IDT. The load-beam has a cross section varying in the longitudinal direction effective to cause the load beam to deflect radially in response to an applied load. The cross section varies in width, height, or both.Type: GrantFiled: December 20, 2005Date of Patent: June 3, 2008Assignee: Honeywell International Inc.Inventors: Paul W. Dwyer, Stephen F. Becka
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Patent number: 6912902Abstract: A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.Type: GrantFiled: March 26, 2003Date of Patent: July 5, 2005Assignee: Honeywell International Inc.Inventors: David L. Malametz, Stephen F. Becka, Robert D. Horning
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Publication number: 20040187578Abstract: A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.Type: ApplicationFiled: March 26, 2003Publication date: September 30, 2004Inventors: David L. Malametz, Stephen F. Becka, Robert D. Horning
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Patent number: 6768412Abstract: A simplified snap-action micromachined thermal switch having a bimodal thermal actuator fabricated from non-ductile materials such as silicon, glass, silicon oxide, tungsten, and other suitable materials using MEMS techniques.Type: GrantFiled: August 20, 2002Date of Patent: July 27, 2004Assignee: Honeywell International, Inc.Inventors: Stephen F. Becka, George D. Davis
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Publication number: 20030034870Abstract: A simplified snap-action micromachined thermal switch having a bimodal thermal actuator fabricated from non-ductile materials such as silicon, glass, silicon oxide, tungsten, and other suitable materials using MEMS techniques.Type: ApplicationFiled: August 20, 2002Publication date: February 20, 2003Applicant: Honeywell International, Inc.Inventors: Stephen F. Becka, George D. Davis
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Patent number: 5097172Abstract: A mounting system for mounting a transducer to a case, such that the transducer position is fixed and stable, and such that stresses on the transducer due to thermal expansion are minimized. The mounting system comprises a band, lower arms extending in a first axial direction from the band, and upper arms extending in a second, opposite axial direction from the band. The transducer arms are connected to the lower, and the upper arms to the case. In response to differential thermal expansion, the arms S bend in a radial direction.Type: GrantFiled: July 20, 1990Date of Patent: March 17, 1992Assignee: Sundstrand Data Control, Inc.Inventor: Stephen F. Becka