Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

Abstract: A diffuser includes an air inlet for receiving an airflow from a hair dryer, a grille having a plurality of air outlets for emitting a first part of the airflow from the diffuser, and a plurality of projections upstanding from the grille for contacting the hair of a user and for emitting a second part of the airflow. Each of the projections has a respective air outlet located in an end portion of the projection which is remote from the grille. The projections are divided into a first set of projections and a second set of projections arranged about the first set of projections. The air outlets of the first set of projections are arranged to emit air towards the second set of projections, and the air outlets of the second set of projections face are arranged to emit air towards the first set of projections.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

Abstract: A diffuser includes an air inlet for receiving an airflow from a hair dryer, and a grille with a plurality of air outlets for emitting at least part of the airflow. Each of the air outlets has substantially the same shape. The plurality of air outlets includes a first set of air outlets located in a first region of the grille, and a second set of air outlets located in a second region of the grille. The grille further includes at least one third region, located between the first region and the second region, which is substantially devoid of these air outlets.

Abstract: An attachment for a hand held appliance, the attachment including an outer wall with a first part which is generally conical in shape, and a fluid inlet into the outer wall, wherein the fluid inlet is formed from a discontinuity in the outer wall. The outer wall may be formed from a first wall and a sleeve. The first wall may define a fluid flow path through the attachment. The sleeve may extend around the first wall forming a second fluid flow path from the fluid inlet in the outer wall, the second fluid flow path extending between the first wall and the sleeve. An outer surface of the sleeve and an outer surface of the first wall may be collinear. The fluid flow path may extend from a first fluid inlet into the attachment to a first fluid outlet. The first fluid inlet may be annular.

Abstract: An attachment for a hand held appliance, the attachment having a first wall, and a bung housed within the first wall wherein each of the first wall and the bung are molded as a single unit which are subsequently joined together. One of the first wall and the bung may include a locating rib and the other of the first wall and the bung may include a locating recess and the locating rib and locating recess are adapted to cooperate together to position the bung with respect to the first wall. In addition to the locating rib and locating recess, the first wall and the bung may be secured using one or more of gluing, welding and screwing the parts together.

Abstract: A diffuser includes a plastics baffle which has an air inlet end, an air outlet end and an outwardly tapering wall extending between the air inlet end and the air outlet end, and which defines a diffusing air chamber. A plurality of circumferentially spaced weld ribs is upstanding from the air outlet end. A plastics grille has a plurality of air outlets and an annular shelf to which the weld ribs of the baffle are ultrasonically welded.

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

Abstract: A diffuser includes a baffle having an air inlet end, an air outlet end and an outwardly tapering wall extending between the air inlet end and the air outlet end, and which defines a diffusing air chamber, and a grille connected to the baffle, the grille including a plurality of air outlets. The air inlet end of the baffle includes an air inlet and a drainage channel, spaced from the air inlet, for receiving water which has entered the air chamber through the air outlets. The drainage channel has drainage holes for draining water away from the air inlet.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

Abstract: A hand dryer comprising a jetting nozzle comprising a duct in fluid communication with a slot which forms a nozzle outlet, and a blower which blows air through the jetting nozzle to produce an air jet. The jetting nozzle is configured such that the angle of inclination of the air jet with respect to a direction which is perpendicular to the longitudinal direction of the slot varies in the longitudinal direction of the slot.

Abstract: A diffuser includes an air inlet for receiving an airflow from a hair dryer, an external grille having a plurality of air outlets for emitting at least part of the airflow from the diffuser, and an internal grille located between the air inlet and the external grille.

Abstract: A diffuser includes an air inlet for receiving an airflow from a hair dryer, a grille having a plurality of air outlets for emitting at least part of the airflow from the diffuser, a baffle having an outwardly tapering wall which defines a diffusing air chamber through which the airflow passes between the air inlet and the air outlets, and an external wall which surrounds the wall of the baffle to define a second air chamber therebetween. The second air chamber has a plurality of ports in fluid communication with the ambient atmosphere.

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.