Patents by Inventor Stephen Fried

Stephen Fried has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170234623
    Abstract: A cooling device includes an enclosure housing, a primary cooling system including a loop heat pipe like (LHPL) device that rejects heat to an external coolant. The LHPL device including an evaporator module, condenser module, vapor line, liquid return path including a liquid return line, one or more compensation chambers, optional inline storage chambers, a working fluid having a liquid and vapor phase and an optional pump in either the vapor or the liquid return line.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 17, 2017
    Inventor: Stephen Fried
  • Patent number: 9261310
    Abstract: A cooling device includes an enclosure housing, an external heat rejection device, a primary cooling system including a loop heat pipe like (LHPL) device. The LHPL device includes an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, several different types of compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: February 16, 2016
    Inventor: Stephen Fried
  • Publication number: 20130228313
    Abstract: A cooling device includes an enclosure housing, an external heat rejection device, a primary cooling system including a loop heat pipe like (LHPL) device. The LHPL device includes an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, several different types of compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway.
    Type: Application
    Filed: April 15, 2013
    Publication date: September 5, 2013
    Inventor: Stephen Fried
  • Publication number: 20110170247
    Abstract: A method and apparatus for a digital utility system. The system may include a housing secured within a wall and partially exposed through an opening in the wall covering. A processing unit may be inserted into the housing (and into the wall) through the opening. Various systems of a building may be connected to the processing unit to receive commands and the like therefrom. A user interface and monitor may connect to the processing unit and extend to cover the opening in the wall covering.
    Type: Application
    Filed: November 30, 2010
    Publication date: July 14, 2011
    Inventor: Stephen Fried