Abstract: An integrated circuit comprises logic circuitry having a plurality of signal paths. A signal path of the plurality of signal paths has a propagation delay greater than a propagation delay of any other signal path of the plurality of signal paths. The signal path includes a plurality of components. The plurality of components is provided with a higher power supply voltage than any other signal path of the plurality of signal paths.

Abstract: An integrated circuit ECO base cell module is formed with PMOS and NMOS gate electrode structures and power supply lines that are electrically separated from one another up to the second metal (M2) layer in a fixed circuit structure that may be reconfigured with one or more conductor elements formed above the M2 layer to form a predetermined circuit function.

Abstract: An integrated circuit comprises logic circuitry having a plurality of signal paths. A signal path of the plurality of signal paths has a propagation delay greater than a propagation delay of any other signal path of the plurality of signal paths. The signal path includes a plurality of components. The plurality of components is provided with a higher power supply voltage than any other signal path of the plurality of signal paths.

Abstract: First circuitry is powered by a first power supply domain and provides a data signal referenced to the first power supply domain. Second circuitry is powered by a second power supply domain that differs from the first power supply domain. The data signal becomes referenced to the second power supply domain by a clocked level shifter that couples the first circuitry to the second circuitry and buffers the data signal from the first power supply domain to the second power supply domain by only using a single supply voltage. The clocked level shifter is clocked by a signal that is used to precharge a first node and a second node of the clocked level shifter until the data signal is valid for at least a setup time period. The first and second nodes are precharged to establish a known state in the clocked level shifter.

Abstract: First circuitry is powered by a first power supply domain and provides a data signal referenced to the first power supply domain. Second circuitry is powered by a second power supply domain that differs from the first power supply domain. The data signal becomes referenced to the second power supply domain by a clocked level shifter that couples the first circuitry to the second circuitry and buffers the data signal from the first power supply domain to the second power supply domain by only using a single supply voltage. The clocked level shifter is clocked by a signal that is used to precharge a first node and a second node of the clocked level shifter until the data signal is valid for at least a setup time period. The first and second nodes are precharged to establish a known state in the clocked level shifter.

Abstract: A circuit for body biasing is provided. The circuit includes: (1) a p-type transistor having a first current terminal, which is coupled to a first voltage supply, a second current terminal, a control terminal, and a bulk terminal; and (2) an n-type transistor having a first current terminal, which is coupled to a second voltage supply different from the first voltage supply, a second current terminal, a control terminal, and a bulk terminal, wherein the bulk terminal of the p-type transistor, the second current terminal of the p-type transistor, and the control terminal of the n-type transistor is coupled to a first node, wherein the control terminal of the p-type transistor, the bulk terminal of the n-type transistor, and the second current terminal of the second transistor is coupled to a second node different from the first node.

Abstract: A segmented bus architecture (800) removes certain ESD circuitry from each I/O pad cell (806, 812) and places it in a power pad cell (808, 814) or in some other unused area of the integrated circuit which incorporates the SBA. The removed ESD circuit is shared by several adjacent I/O pad cells via a segmented ESD bus. As a result, each individual I/O pad cell may be reduced in size.

Abstract: An electrostatic discharge (ESD) circuit (700) provides robust protection to an input/output driver circuit (10). The discharge path is provided by a bipolar transistor (202). The bipolar device is triggered by a combination of an n-type MOSFET (702), a string of diodes (200), and a biasing circuit (704). The trigger point of the MOSFET is programmable by varying the number of individual diodes in the string of diodes. The relatively high transconductance of the n-type MOSFET allows the use of a smaller ESD circuit for a given degree of protection.

Abstract: Bond pads (394, 106) and bond pad openings (62, 108) are formed such that the bond pad openings (62, 108) are asymmetric to the conductive sections (398, 106) of the bond pads (394, 106). If the bond pads are more likely to lift from the scribe line side of the bond pad (394, 106), the bond pad openings (62, 108) are formed such that the passivation layer (52) overlies more of the conductive section (398, 106) near the scribe line (40). If the bond pads (394, 106) are more likely to lift from the other side, the passivation layer (52) overlies more of the other side of the conductive section (398, 106). In addition to reducing the risk of lifting, contamination problems should also be reduced.

Abstract: An SOI structure (20) includes a semiconductor layer (15) formed on an insulating substrate (12). The semiconductor layer (15) is partitioned into an ESD protection portion (32) and a circuitry portion (34). A portion of the semiconductor layer (15) in the ESD protection portion (32) and a different portion of the semiconductor layer (15) in the circuitry portion (34) are differentially thinned. A device (60) which implements the desired circuit functions of the SOI structure (20) is fabricated in the circuitry portion (34). An ESD protection device (40) is fabricated in the ESD protection portion (32). The thick semiconductor layer (15) in the ESD protection portion (32) serves to distribute the ESD current and heat over a large area, thereby improving the ability of the SOI structure (20) to withstand an ESD event.

Abstract: A semiconductor device with an electrostatic discharge (ESD) protection transistor is devised, wherein the ESD protection transistor has halo regions of an opposite conductivity type from the source and drain regions adjacent thereto. In one embodiment, the ESD protection transistor is a thick field oxide (TFO) transistor. In some cases, the halo regions may be provided with an ion implant step without the use of an extra mask. The halo regions permit the ESD protection transistor to have its breakdown voltage adjusted so that it turns on before the device it is protecting is affected by an ESD event. The use of halo regions avoids the increase in device area and adverse effects to the AC performance of the circuit being protected that are disadvantages of prior approaches.

Abstract: A semiconductor device with an electrostatic discharge (ESD) protection transistor is devised, wherein the ESD protection transistor has halo regions of an opposite conductivity type from the source and drain regions adjacent thereto. In one embodiment, the ESD protection transistor is a thick field oxide (TFO) transistor. In some cases, the halo regions may be provided with an ion implant step without the use of an extra mask. The halo regions permit the ESD protection transistor to have its breakdown voltage adjusted so that it turns on before the device it is protecting is affected by an ESD event. The use of halo regions avoids the increase in device area and adverse effects to the AC performance of the circuit being protected that are disadvantages of prior approaches.

Abstract: Bond pads (394, 106) and bond pad openings (62, 108) are formed such that the bond pad openings (62, 108) are asymmetric to the conductive sections (398, 106) of the bond pads (394, 106). If the bond pads are more likely to lift from the scribe line side of the bond pad (394, 106), the bond pad openings (62, 108) are formed such that the passivation layer (52) overlies more of the conductive section (398, 106) near the scribe line (40). If the bond pads (394, 106) are more likely to lift from the other side, the passivation layer (52) overlies more of the other side of the conductive section (398, 106). In addition to reducing the risk of lifting, contamination problems should also be reduced.