Abstract: A magneto-optical head with a centrally-located solid immersion lens and a coil formed radially about the lens advantageously utilizes an insulating material with a relatively high thermal conductivity for isolating the coil and avoiding heat damage to the head when current is passed through the head during a write operation. First and second coils in first and second coil layers are coupled by a via to form a continuous coil. A combination of a chemical-mechanical contouring operation and the lack of any intervening low thermal conductivity material adjacent the coil effectively produces an insulation layer that is thin but has a contour with a very smooth surface, resulting in a highly compact multiple-level coil.

Abstract: Etched substrate produced by chemical-mechanical processing of a patterned substrate which selectively etches patterned portions of the substrate surface, producing deep narrow features with a rapid etch rate. This chemical-mechanical processing is termed chemical-mechanical etching and produces a result that is substantially the opposite of the planarization that is achieved by conventional chemical-mechanical polishing (CMP). A chemical-mechanical polishing (CMP) technique which is widely used for planarization of surfaces is converted for usage as an etching technique, a chemical-mechanical etching (CME) technique, by forming a patterned mask on the substrate surface prior to mechanical polishing. The usage of chemical-mechanical polishing techniques in this manner yields an etching method with properties including a rapid etch rate, a highly controllable etch rate, a highly controllable etch depth, and a greatly selective etch directionality.

Abstract: Chemical-mechanical processing of a patterned substrate selectively etches patterned portions of the substrate surface, producing deep narrow features with a rapid etch rate. This chemical-mechanical processing is termed chemical-mechanical etching and produces a result that is substantially the opposite of the planarization that is achieved by conventional chemical-mechanical polishing (CMP). A chemical-mechanical polishing (CMP) technique which is widely used for planarization of surfaces is converted for usage as an etching technique, a chemical-mechanical etching (CME) technique, by forming a patterned mask on the substrate surface prior to mechanical polishing. The usage of chemical-mechanical polishing techniques in this manner yields an etching method with properties including a rapid etch rate, a highly controllable etch rate, a highly controllable etch depth, and a greatly selective etch directionality.

Abstract: A method of fabricating thin film magnetic heads on a thin film substrate uses a chemical-mechanical contouring (CMC) step after completion of the fundamental thin film head structure to form a curved surface on the substrate for the individual thin film magnetic heads of a substantial plurality of heads on a thin film substrate. A special CMC process utilizes a soft polishing pad, applying mechanical contouring motion at a slow speed, typically on the order of 1/3 a typical conventional CMP rotational speed, and at a relatively high pressure, typically two to three times a typical conventional CMP applied pressure.

Abstract: A method of fabricating thin film magnetic heads on a thin film substrate uses a chemical-mechanical contouring (CMC) step after completion of the fundamental thin film head structure to form a curved surface on the substrate for the individual thin film magnetic heads of a substantial plurality of heads on a thin film substrate. A special CMC process utilizes a soft polishing pad, applying mechanical contouring motion at a slow speed, typically on the order of 1/3a typical conventional CMP rotational speed, and at a relatively high pressure, typically two to three times a typical conventional CMP applied pressure.

Abstract: A method of enhanced chemical-mechanical polishing (E-CMP) utilizes an oxygen-rich liquid etchant in an abrasive slurry to form a substantially planar surface on a thin film magnetic head to substantially avoid pole recession. Illumination of the thin film magnetic head with ultraviolet light during E-CMP polishing greatly enhances the effect of the oxygen-rich etchant.

Abstract: A method and structure for affixing a component to a structure in an aligned position facilitates fabrication of diminutive assemblies, such as integrated circuits. The component is placed upon a support structure. The component has an alignment marking. The support structure has a viewing aperture and an alignment pattern. The support structure and component are arranged so that the alignment marking and the alignment pattern are visible through the viewing aperture. The alignment marking and the alignment pattern are simultaneously viewed through the viewing aperture and the component is aligned upon the support structure so that the alignment marking of the component is aligned with respect to the alignment pattern of the support structure. The aligned component is bonded to a structural member.